Plasma Dicing Recipe Control for Consistent Element Chip Quality

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Solution Overview

Problem

The quality of element chips produced through plasma etching is unstable due to variations in the shape of the protection layer or mask, or deviations in etching amounts, leading to inconsistent chip quality.

Innovation Solution

A dicing system and method that includes a control unit to modify recipes for forming a protection layer, patterning, and plasma etching based on real-time processing data, using feedback and feedforward controls to adjust conditions and improve chip quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple processing steps (protection layer formation, patterning, plasma etching) are performed sequentially, then element chips can be produced, but variations in protection layer shape, mask shape, or etching amount lead to unstable chip quality

Engineering Contradiction:
Improveelement chip quality consistencyVSAvoidprocess stability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent implements a feedback control system where the measurement apparatus measures the actual protection layer shape, mask shape, and etching amount, and the control unit adjusts subsequent processing parameters based on these measurements. This closed-loop feedback mechanism compensates for variations accumulated during sequential processing steps, ensuring consistent element chip quality despite process variations.

Inventive Principle:
Principle #23Feedback

2Ease of manufacture

If fixed recipes are used for protection layer formation, patterning, and plasma etching, then processing is simple, but variations in processing conditions cause inconsistent etching amounts and mask shapes

Engineering Contradiction:
Improveprocessing simplicityVSAvoidetching amount consistency
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent transitions from fixed static recipes to dynamic adaptive recipes. The control unit modifies processing parameters in real-time based on measurements from the measurement apparatus. This dynamic adjustment allows the system to maintain processing simplicity while achieving consistent etching amounts and mask shapes by adapting to actual processing conditions.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If protective measures are added to compensate for variations, then chip quality can be improved, but the number of processing steps and system complexity increase

Engineering Contradiction:
Improvechip qualityVSAvoidsystem complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent combines the measurement function and control function into an integrated system. The measurement apparatus is coupled with the control unit, which automatically adjusts processing parameters based on measurements. This merging eliminates the need for separate protective measures and manual interventions, improving chip quality while maintaining system simplicity through automation.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enhances the quality and productivity of element chips by dynamically adjusting processing parameters based on actual data, reducing variations and improving consistency.

Implementation Method 1

a plasma treatment apparatus that plasma etches the substrate exposed from the mask to form a plurality of element chips

Methodology Applied
Scientific EffectPlasma etching: Plasma

Data Source

PatentUS12438051B2Dicing system and dicing method
Publication Date: 2025.10.07 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US12438051B2 patent drawing
  • US12438051B2 patent drawing
  • US12438051B2 patent drawing

AI summary

Disclosed is a dicing system including a protection layer forming apparatus, a patterning apparatus, a plasma treatment apparatus, a measuring apparatus that obtains at least of first processing data relating to a protection layer, second processing data relating to a mask, and third processing data relating to element chips, and a control unit that operates at least one of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus on a recipe that is defined for each of the apparatuses. The control unit determines, based on at least one of the first processing data, whether or not to modify the recipe, the second processing data, and the third processing data, modifies the at least one of the recipes if the recipe needs to be modified, and operates at least one of the protection layer forming apparatus, the patterning apparatus, and the plasma treatment apparatus based on the modified recipe.