Plasma Processing Apparatus Dielectric Power Distribution

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Solution Overview

Problem

Plasma processing apparatuses face challenges in achieving uniform plasma density and electric field distribution due to standing waves generated by high-frequency radio-frequency power, particularly when metal components are involved, leading to non-uniform etching and film formation.

Innovation Solution

The apparatus incorporates a rotationally symmetric arrangement of dielectric members connected to the electrode and a feeding rod, which grounds a conductive plate-shaped member parallel to the electrode, to distribute radio-frequency power uniformly and reduce inductance, thereby ensuring even plasma generation across the electrode surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If radio-frequency power is increased to increase plasma density, then plasma density increases, but standing waves are generated causing non-uniform electric field distribution and non-uniform plasma density

Engineering Contradiction:
Improveplasma densityVSAvoiduniformity of plasma density
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

A dielectric member is introduced as an intermediary between the feeding rod and the electrode. This dielectric member has a specific shape (such as a cylindrical shape with the feeding rod passing through its center) that helps distribute the radio-frequency power uniformly across the electrode surface, preventing standing wave formation while maintaining high plasma density

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the physical parameters of the power transmission system by introducing a dielectric material with specific permittivity properties. This modifies the electromagnetic field distribution and impedance characteristics, allowing for uniform power distribution at high radio-frequency powers without standing waves

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If a conductive member is added to the feeding rod to reduce inductance, then inductance is reduced and plasma density becomes uniform, but device complexity increases

Engineering Contradiction:
Improveuniformity of plasma densityVSAvoidstructure of feeding system
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention replaces the mechanical/conductive solution (adding conductive members to the feeding rod) with a dielectric-based electromagnetic solution. The dielectric member achieves uniform power distribution through its electromagnetic properties rather than through mechanical modification of the feeding rod structure

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The dielectric member serves as an intermediary that simplifies the overall structure compared to complex conductive modifications. Instead of modifying the feeding rod with multiple conductive components, a single dielectric member with appropriate geometry achieves the desired uniform power distribution

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration results in highly uniform plasma density and etching rates, enhancing the consistency and quality of plasma processing, especially at higher frequencies.

Implementation Method 1

A radio-frequency power supply applies radio-frequency power to a first electrode. A feeding rod feeds the radio-frequency power to a center of a surface of the first electrode

Methodology Applied
Scientific EffectRadio-frequency power transmission: Electromagnetic Induction

Implementation Method 2

The dielectric member has a shape that is rotationally symmetric with respect to the center of the first electrode

Methodology Applied
Scientific EffectDielectric insulation: Dielectric

Data Source

PatentUS11676799B2Plasma processing apparatus
Publication Date: 2023.06.13 TOKYO ELECTRON LTD
  • US11676799B2 patent drawing
  • US11676799B2 patent drawing
  • US11676799B2 patent drawing

AI summary

A plasma processing apparatus includes a chamber; a first electrode facing an inside of the chamber; a radio-frequency power supply configured to supply a radio-frequency power to the first electrode; a feeding rod configured to feed the radio-frequency power to a center of a surface of the first electrode opposite to a surface facing the inside of the chamber; a conductive plate provided in parallel to the surface of the first electrode opposite to the surface facing the inside of the chamber, the plate being grounded; and a dielectric plate connecting the first electrode and the conductive plate, and having a shape that is rotationally symmetric with respect to a center of the first electrode.