Plasma Diffuser Layout for Uniform Radical Post-Etch Treatment
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Solution Overview
Problem
Conductive lines in display panels face corrosion due to residual process gases after etching, and the removal of the photoresist layer is typically performed as a separate process, which is inefficient.
Innovation Solution
A plasma post-processing apparatus and method that integrates corrosion prevention treatment and photoresist layer removal in the same chamber using a diffuser with varying hole diameters and shapes to uniformly spray radicals, including water vapor and oxygen, to address corrosion and efficiently remove the photoresist layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate process is used for photoresist layer removal, then the photoresist layer can be removed effectively, but the manufacturing process complexity increases and productivity decreases
Solution Approach 1:
The patent combines the corrosion prevention treatment and photoresist layer removal processes into a single integrated plasma treatment chamber. The multi-functional diffuser structure enables both functions to be performed simultaneously or sequentially in one step, eliminating the need for separate processing steps and thereby improving productivity while maintaining effective photoresist removal.
Solution Approach 2:
The diffuser structure is designed with multiple functions: it distributes process gas uniformly for corrosion prevention, removes photoresist layer through plasma treatment, and can be adjusted for different processing modes. This multi-functional design allows a single apparatus to perform multiple tasks that traditionally required separate processes.
2Productivity
If process gas is provided during etching, then the etching process can be performed, but residual process gas causes corrosion of conductive lines
Solution Approach 1:
The patent converts the harmful residual process gas into a beneficial treatment by using plasma activation. The same process gas that remains after etching is reactivated through plasma treatment to perform corrosion prevention and photoresist removal, transforming a harmful byproduct into a useful processing agent.
Solution Approach 2:
The plasma treatment is performed immediately after the etching process while the substrate is still in the chamber and the process gas residues are present. This preliminary action prevents corrosion before it can occur and removes photoresist layer in advance of subsequent processing steps.
3Ease of manufacture
If multiple diffusers with uniform hole diameters are used, then the gas distribution is simple to manufacture, but the plasma spraying uniformity across the substrate is poor
Solution Approach 1:
The patent applies local quality by varying the hole diameters of diffusers based on their position relative to the substrate center. The central diffuser has smaller hole diameters while outer diffusers have larger hole diameters, creating a non-uniform structure that compensates for the natural decrease in plasma density from center to edge, thereby achieving uniform plasma distribution across the entire substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated approach effectively prevents corrosion and simplifies the post-processing steps by uniformly dispersing radicals across the substrate, ensuring thorough treatment and efficient removal of the photoresist layer in a single chamber.
Implementation Method 1
plasma generators respectively connected to pipes that supply process gases
Implementation Method 2
diffusers each of which increases in width in a direction away from the work substrate and each of the diffusers having holes
Data Source
AI summary
Disclosed is a plasma post-processing apparatus including a chamber, a stage disposed inside of the chamber, a work substrate disposed on the stage, diffusers each of which increases in width in a direction away from the work substrate and having holes, and disposed above the stage, transfer pipes respectively connected to the diffusers, and plasma generators respectively connected to pipes that supply process gases and are respectively connected to the transfer pipes, and a diameter of the holes defined in a diffuser disposed at a center of the work substrate among the diffusers is less than a diameter of holes defined in each of remaining diffusers among the diffusers.