Plasma Dry Etch for OLED Shadow Mask Residue Removal
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Solution Overview
Problem
The existing methods for producing organic light-emitting diodes (OLEDs) face challenges in efficiently removing organic electroluminescent residue from shadow masks, leading to mask degradation and increased manufacturing costs due to the use of wet etching processes, which are hazardous and damage-sensitive.
Innovation Solution
A dry etch process using a fluorine-containing gas, optionally an oxygen-containing gas, and an additive gas, activated in a remote chamber to form reactive species that volatilize and remove organic electroluminescent residue from substrates and shadow masks without exposing them to liquid chemicals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wet etching processes are used to remove organic electroluminescent residue from shadow masks, then the residue can be cleaned, but the shadow mask life is significantly limited and hazardous chemicals are exposed to operators
Solution Approach 1:
The patent replaces wet chemical etching with a plasma-based dry etching process. The plasma process uses reactive species generated from gas discharge to chemically react with and remove organic residues, eliminating the need for liquid chemical solutions while extending mask life and removing hazardous chemical exposure
Solution Approach 2:
The patent changes the physical and chemical parameters of the etching process by using controlled plasma conditions (gas composition, power, pressure, temperature) to achieve selective removal of organic residues without damaging the shadow mask, thereby extending mask life while maintaining cleaning effectiveness
2Ease of manufacture
If wet etching chemicals are used to clean residues, then the cleaning process can be performed, but the process chamber must be removed and disassembled and operators are exposed to hazardous fluids
Solution Approach 1:
The patent substitutes wet chemical cleaning with a plasma-based dry cleaning process that can be performed in situ within the process chamber. This eliminates operator exposure to hazardous chemicals while maintaining effective residue removal capability
Solution Approach 2:
The patent uses plasma as an intermediary medium to transfer the cleaning function from hazardous liquid chemicals to a controlled gas-phase reactive species environment. The plasma reactive species perform the cleaning function without requiring direct operator handling of hazardous substances
3Manufacturing precision
If multiple shadow masks are used for multiple depositions, then complete OLED patterns can be achieved, but manufacturing costs increase due to frequent mask replacement
Solution Approach 1:
The patent implements a residue removal process that recovers shadow masks from a discarded state (residue-covered) to a reusable state (clean). This allows masks to be used for multiple deposition cycles, reducing the frequency of mask replacement while maintaining pattern quality
Solution Approach 2:
The patent enables continuous reuse of shadow masks through in-situ plasma cleaning between deposition cycles. This eliminates downtime associated with mask replacement and maintains continuous productive operation, reducing overall manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process extends the life of shadow masks, reduces manufacturing costs, and avoids the hazards associated with wet etching by effectively removing residues in situ, maintaining the mask's integrity and efficiency.
Implementation Method 1
activating the process gas in a remote chamber using at least one energy source to provide reactive species
Implementation Method 2
contacting the surface of the substrate with the reactive species to volatilize and remove the organic electroluminescent residue
Implementation Method 3
contacting the surface of the substrate with the reactive species to volatilize and remove the organic electroluminescent residue
Data Source
AI summary
A process for removing organic electroluminescent residues from a substrate is described herein. The process includes the steps of providing a process gas comprising a fluorine-containing gas, optionally an oxygen-containing gas, and optionally an additive gas; activating the process gas in a remote chamber using at least one energy source to provide reactive species; and contacting the surface of the substrate with the reactive species to volatilize and remove the organic electroluminescent residue from the surface.