Plasma Processing Edge Ring Temperature Control

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Solution Overview

Problem

Current plasma processing systems for semiconductor manufacturing lack precise temperature control over the workpiece and edge ring assembly, which can lead to uneven temperature distribution and affect the etching process quality.

Innovation Solution

Incorporation of temperature modifying elements, specifically a Peltier structure with first and second thermoelectric elements arranged in various planar patterns within the coupling ring of the plasma processing system, allowing for individual control of temperature across the edge ring and electrostatic chuck to maintain symmetrical temperature throughout the workpiece.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If temperature modifying elements are added to the coupling ring, then temperature control precision is improved, but device complexity increases

Engineering Contradiction:
Improvetemperature control precisionVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The coupling ring is segmented by dividing it into multiple regions (first region and second region) with different temperature modifying elements. Each region can be independently controlled to achieve precise temperature distribution across the workpiece, resolving the contradiction by localizing temperature control functions rather than using a single complex control system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different temperature modifying elements are placed in different regions of the coupling ring based on local temperature requirements. The first temperature modifying elements are positioned for the first region while second temperature modifying elements serve the second region, allowing each area to have optimized temperature control tailored to its specific needs.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If multiple temperature modifying elements are used in different regions, then temperature uniformity is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The coupling ring structure is divided into multiple segments or regions, each equipped with appropriate temperature modifying elements. This segmentation allows for modular manufacturing where each region can be independently fabricated and then assembled, reducing overall manufacturing complexity while achieving uniform temperature distribution across the entire workpiece.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables precise and selective temperature control, ensuring consistent processing conditions and improving the quality of the etching process by maintaining uniform temperature across the workpiece.

Implementation Method 1

Incorporation of temperature modifying elements, specifically a Peltier structure with first and second thermoelectric elements arranged in various planar patterns within the coupling ring

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS11430639B2Plasma processing system
Publication Date: 2022.08.30 XIA TAI XIN SEMICON QING DAO LTD
  • US11430639B2 patent drawing
  • US11430639B2 patent drawing
  • US11430639B2 patent drawing

AI summary

A plasma processing system is disclosed. The plasma processing system includes an electrostatic chuck (ESC) and an edge ring assembly surrounding the ESC. The edge ring assembly includes a coupling ring and temperature modifying elements disposed within the coupling ring.