Plasma Electrode Coating to Prevent Film Detachment Dust

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Solution Overview

Problem

The detachment of deposition films from electrode surfaces during plasma-based film formation leads to dust generation, particularly when using high-stress films like WBC on aluminum electrodes, due to poor adhesiveness.

Innovation Solution

Forming a coat film made of aluminum fluoride on the electrode surfaces to enhance adhesiveness with the deposition film, preventing detachment and dust generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a deposition film is formed on an aluminum electrode using plasma, then the film formation process is completed, but the film detaches from the electrode surface causing dust generation

Engineering Contradiction:
Improvefilm adhesion qualityVSAvoiddust generation
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

A coat film containing aluminum and fluorine or aluminum and oxygen is formed as an intermediary layer between the aluminum electrode and the deposition film. This intermediate coat film improves the adhesion between the electrode and deposition film, preventing detachment and dust generation while maintaining the plasma-based film formation process

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a coat film containing aluminum and fluorine or aluminum and oxygen is formed on the electrode surface, then adhesion between the deposition film and electrode is improved, but the process complexity increases

Engineering Contradiction:
Improvefilm adhesionVSAvoidprocess steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The coat film formation is merged with the existing plasma-based film formation process by using the same plasma generation mechanism. The plasma process that forms the deposition film also deposits the coat film containing aluminum and fluorine or aluminum and oxygen, combining multiple functions into a single integrated process step

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents dust generation by ensuring high adhesiveness between the deposition film and the electrode, maintaining process integrity and efficiency.

Implementation Method 1

The electrode generates plasma from gas supplied into the chamber to form a first film on the substrate by the plasma

Methodology Applied
Scientific EffectPlasma: Plasma

Data Source

PatentUS12406842B2Substrate processing apparatus and method of producing semiconductor device
Publication Date: 2025.09.02 KIOXIA CORP
  • US12406842B2 patent drawing

AI summary

A substrate processing apparatus includes a chamber to accommodate a substrate. The apparatus includes a stage to support the substrate in the chamber. The apparatus includes an electrode disposed above the stage and containing aluminum. The electrode generates plasma from gas supplied into the chamber to form a first film on the substrate by the plasma. The apparatus further includes a second film formed on a surface of the electrode and containing aluminum and fluorine or containing aluminum and oxygen.