Plasma Electrode Filter Circuit for Charge Removal Without RF Loss

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing substrate treatment methods face challenges in reducing electrostatic charging of power electrodes during semiconductor manufacturing, leading to arcing and disruptions in plasma generation due to accumulated charges, with existing solutions either risking arcing or being limited to high-frequency electric field shutdown.

Innovation Solution

A substrate treatment apparatus and method incorporating a filter unit connected to the upper electrode, which includes a low pass filter circuit between the electrode and ground, allowing charge removal while preventing high-frequency power loss, and a gas feeding unit with a filter circuit to manage charge accumulation and plasma generation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a filter unit is connected to the upper electrode to remove accumulated charges, then electrostatic charging is reduced and arcing is prevented, but there is a risk of short-circuiting high-frequency power

Engineering Contradiction:
Improveelectrostatic charging reductionVSAvoidhigh-frequency power loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

An impedance matching unit is introduced as an intermediary component between the filter unit and the high-frequency power source. This intermediary allows the filter unit to remove accumulated charges from the upper electrode while the impedance matching unit prevents high-frequency power from being short-circuited, thus resolving the contradiction between charge removal and power preservation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If an ionizer is used to directly generate ions for charge removal, then accumulated charges are eliminated, but arcing risk increases and electric field distribution is affected

Engineering Contradiction:
Improvecharge removal effectivenessVSAvoidarcing risk
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical/ion-based charge removal method (ionizer) with an electrical filtering method. Instead of using an ionizer to generate ions that carry charges away, the system uses a filter unit connected to the upper electrode that passively removes accumulated charges through electrical field effects, thereby eliminating the arcing risk associated with ionizer exposure while maintaining effective charge removal

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively reduces electrostatic charging on power electrodes, preventing arcing and maintaining stable plasma generation without short-circuiting high-frequency power, ensuring continuous and efficient substrate treatment processes.

Implementation Method 1

a filter unit connected to the upper electrode, the filter unit removing charges accumulated on one surface of the upper electrode

Methodology Applied
Scientific EffectCharge filtration: Filter (electronic)

Implementation Method 2

a plasma generation unit including an upper electrode provided in the upper chamber and a high-frequency power source connected to the upper electrode, the high-frequency power source supplying high-frequency power

Methodology Applied
Scientific EffectPlasma generation: Plasma

Data Source

PatentUS20240290587A1Apparatus and method for treating substrate
Publication Date: 2024.08.29 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20240290587A1 patent drawing
  • US20240290587A1 patent drawing
  • US20240290587A1 patent drawing

AI summary

A substrate treatment apparatus includes a processing chamber including an upper chamber and a lower chamber having a treatment space for treating a substrate, a substrate support unit provided in the treatment space, the substrate support unit fixing the substrate, a gas supply unit supplying a process gas to the inside of the upper chamber and the treatment space, a plasma generation unit including an upper electrode provided in the upper chamber and a high-frequency power source connected to the upper electrode, the high-frequency power source supplying high-frequency power through an impedance matcher, and a filter unit connected to the upper electrode, the filter unit removing charges accumulated on one surface of the upper electrode.