Plasma Electrode and Mimic Structure for Uniform Substrate Processing

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Solution Overview

Problem

The challenge in semiconductor and display device manufacturing is achieving precise plasma control for processes like etching, ashing, and deposition due to pattern miniaturization, which existing technologies struggle to address effectively.

Innovation Solution

A substrate processing apparatus is designed with a chamber containing first and second electrodes and magnetic bodies, including magnetic field generators and mimic structures, to control plasma formation and distribution uniformly across the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If magnetic field generators with coils are used to control plasma, then plasma distribution uniformity is improved, but magnetic field analysis complexity increases

Engineering Contradiction:
Improveplasma distribution uniformityVSAvoidmagnetic field analysis complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies the copying principle by introducing mimic structures that replicate the geometric characteristics of electrode structures. These mimic structures create equivalent magnetic fields that mirror the effects of the actual electrodes, allowing complex magnetic field analysis to be simplified into equivalent, easier-to-analyze configurations while maintaining plasma distribution uniformity.

Inventive Principle:
Principle #26Copying

2Length of moving object

If pattern miniaturization is implemented, then device feature size is reduced, but plasma control precision requirement increases

Engineering Contradiction:
Improvedevice feature sizeVSAvoidplasma control precision
Core Design Contradiction:
Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies local quality by configuring magnetic field generators and mimic structures with specific geometric arrangements optimized for different regions of the processing chamber. The magnetic field strength and distribution are locally adjusted through the positioning and dimensioning of coil structures to achieve uniform plasma control across miniaturized device features.

Inventive Principle:
Principle #3Local quality

3Reliability

If multiple magnetic bodies are used to control plasma, then plasma control capability is improved, but device structure complexity increases

Engineering Contradiction:
Improveplasma control capabilityVSAvoiddevice structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies merging by integrating mimic structures directly with magnetic field generators into unified magnetic body assemblies. This combination allows multiple functional elements (magnetic field generation and plasma control) to be merged into single structural units, improving plasma control capability while reducing overall device structure complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus ensures uniform plasma density and simplified magnetic field analysis, leading to consistent and efficient processing results.

Implementation Method 1

a magnetic body to control the plasma formed in the internal space of the chamber. The magnetic body includes a magnetic field generator

Methodology Applied
Scientific EffectMagnetic field: Magnetic Field

Implementation Method 2

The magnetic field generator includes a coil formed by stacked turns of a wire

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 3

a first electrode configured to form plasma in an internal space of the chamber; a second electrode facing the first electrode and configured to form plasma

Methodology Applied
Scientific EffectPlasma: Plasma

Data Source

PatentUS20260005002A1Substrate processing apparatus
Publication Date: 2026.01.01 SAMSUNG ELECTRONICS CO LTD
  • US20260005002A1 patent drawing
  • US20260005002A1 patent drawing
  • US20260005002A1 patent drawing

AI summary

A substrate processing apparatus includes: a chamber configured to process a substrate; a first electrode configured to form plasma in an internal space of the chamber; a second electrode facing the first electrode and configured to form plasma in the internal space of the chamber; and a magnetic body to control the plasma formed in the internal space of the chamber. The magnetic body includes a magnetic field generator, an electrode structure, and a mimic structure. The magnetic field generator includes a coil formed by stacked turns of a wire having two ends. The electrode structure is formed by both ends of the wire. The mimic structure is attached to the magnetic field generator and spaced apart from the electrode structure. The electrode structure has a length and the mimic structure has a length substantially the same as the length of the electrode structure.