Plasma Electrode Layout for Uniform Substrate Treatment
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining uniform plasma strength across the substrate surface due to variations in process conditions, gas types, and temperatures, leading to reduced substrate quality.
Innovation Solution
The substrate processing apparatus incorporates a design with first and second protrusion electrodes of different lengths and injection holes, which are inserted into openings in a second electrode, allowing for controlled plasma strength and gas flow rate adjustments in specific regions to compensate for plasma strength deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma is generated between the gas injection unit and the substrate, then the processing process can be performed, but the plasma strength becomes non-uniform across the substrate surface due to process conditions, gas types, and temperature variations
Solution Approach 1:
The gas injection unit is divided into multiple injection units (first, second, third, and fourth injection units) that are positioned at different locations relative to the substrate. Each injection unit can independently control gas flow to specific regions, allowing for localized adjustment of plasma strength. This enables different regions of the substrate to receive optimized gas injection parameters tailored to their specific plasma strength requirements, thereby achieving uniform plasma strength across the entire substrate surface.
Solution Approach 2:
The invention adjusts operational parameters such as gas flow rates, injection positions, and temperatures for each injection unit to optimize plasma strength distribution. By independently controlling these parameters for each injection unit, the system can compensate for variations in plasma strength across different regions of the substrate, ensuring uniform processing conditions throughout.
2Manufacturing precision
If the gas injection unit uses a single uniform structure, then the device complexity is low, but the plasma strength uniformity across the substrate surface deteriorates
Solution Approach 1:
The gas injection unit is segmented into multiple independent injection units (first, second, third, and fourth injection units), each capable of independent operation and parameter adjustment. This segmentation allows for precise control of gas flow to different regions of the substrate, enabling uniform plasma strength distribution. The modular structure of multiple injection units provides the flexibility needed to address plasma uniformity issues while maintaining a manageable system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the uniformity of plasma strength across the substrate surface, improving the quality of the processing outcome by controlling plasma strength and gas distribution in each region.
Implementation Method 1
plasma generated between the gas injection unit and the substrate supported by the supporting unit is used
Data Source
AI summary
The present disclosure relates to a substrate treatment apparatus comprising: a process chamber; a first electrode positioned in the upper part of the process chamber; a second electrode positioned below the first electrode and including a plurality of openings; a plurality of protruding electrodes extending from the first electrode to the plurality of openings of the second electrode; and a substrate support part facing the second electrode and supporting a substrate.