Plasma Emission Mapping With Multi-Spectroscope Stage Monitoring
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Solution Overview
Problem
Existing plasma processing systems lack the capability to accurately measure and visualize the light emission intensity distribution of plasma in real-time, which is crucial for optimizing processing conditions and ensuring consistent quality in semiconductor manufacturing.
Innovation Solution
A monitoring device with a plate-shaped base substrate and multiple upward-facing spectroscopes is placed on the stage of a plasma processing apparatus, allowing for the acquisition of light emission intensity distribution data by non-overlapping measurement regions, enabling precise measurement and visualization of plasma characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single optical detector is used to monitor plasma, then the device complexity is low, but the measurement precision of light emission intensity distribution is insufficient
Solution Approach 1:
The monitoring device is divided into multiple spectroscopes, each responsible for monitoring a specific region of the plasma. This segmentation allows for precise measurement of light emission intensity distribution across different plasma regions while keeping each individual spectroscope relatively simple in structure.
Solution Approach 2:
The patent transitions from a single-point measurement to a spatial distribution measurement by arranging multiple spectroscopes in different positions. This adds a spatial dimension to the monitoring system, enabling the acquisition of light emission intensity distribution data across the plasma processing chamber.
2Loss of information
If multiple spectroscopes are disposed apart from each other to measure different regions, then the light emission intensity distribution can be visualized, but the device complexity increases
Solution Approach 1:
Multiple spectroscopes are used to perform the same function (light emission intensity measurement) but at different spatial positions. This multi-functional arrangement enables comprehensive monitoring of the entire plasma region while maintaining the simplicity of individual measurement units.
Solution Approach 2:
The patent uses multiple copies of the spectroscope component, each identical in structure but positioned differently to monitor various plasma regions. This copying approach allows for comprehensive spatial coverage while reusing the same proven measurement technology.
3Productivity
If the monitoring device is placed on the stage, then the measurement is performed in real-time during plasma processing, but the stage space is occupied
Solution Approach 1:
The monitoring device occupies only a portion of the stage surface, using minimal space while providing comprehensive plasma monitoring. The compact design of the monitoring device allows it to coexist with other stage components without significantly reducing the available processing area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides clear separation and visualization of plasma light emission intensities across different regions, facilitating intuitive understanding and optimization of plasma processing conditions, thereby enhancing the quality and consistency of semiconductor manufacturing processes.
Implementation Method 1
a plurality of spectroscopes having optical axes facing upward on the base substrate, and being disposed apart from each other to acquire light emission intensities of the plasma
Data Source
AI summary
A plasma monitoring system includes a monitoring device and a control device. The monitoring device is a device to be placed on a stage in the plasma processing apparatus. The monitoring device includes a plate-shaped base substrate, and a plurality of spectroscopes having optical axes facing upward on the base substrate, and being disposed apart from each other to acquire light emission intensities of the plasma. The control device acquires light emission intensity distribution data of the plasma in the plasma processing apparatus based on the light emission intensity acquired by each of the plurality of spectroscopes.


