Removable Plasma Etching Source for Sputter Tool Fixture Cleaning
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Solution Overview
Problem
Data storage system components, such as disc holding fixtures in sputter deposition tools, often accumulate contaminants, which existing technologies fail to effectively clean due to exposure to environmental contaminants and sputter particles during prolonged use.
Innovation Solution
A plasma etching source is designed to be easily installable into sputter deposition tools, utilizing a high-speed stream of glow discharge plasma to clean surfaces of components by bombarding them with suitable particles, effectively removing contaminants from disc holding fixtures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing cleaning technologies are used on disc holding fixtures, then the fixtures are exposed to environmental contaminants and sputter particles during prolonged use, but they fail to effectively remove accumulated contaminants
Solution Approach 1:
The patent applies plasma etching, a process originally designed for material removal in semiconductor fabrication, to clean disc holding fixtures. The plasma process converts the harmful accumulation of sputter particles and contaminants into a beneficial cleaning mechanism by using reactive plasma species to chemically etch and remove the contaminants from the fixture surfaces, thereby converting a degradation problem into a solution opportunity.
Solution Approach 2:
The patent changes the cleaning mechanism from conventional mechanical or chemical methods to plasma-based etching by altering the physical and chemical parameters of the cleaning process. Plasma provides high-energy ions and reactive species that can effectively remove tightly adhered sputter particles at controlled temperatures, changing the cleaning parameters to achieve superior contaminant removal without damaging the fixture.
2Productivity
If an etching source is permanently integrated into the sputter deposition tool, then cleaning can be performed continuously, but the device complexity increases
Solution Approach 1:
The patent segments the cleaning function from the main sputter deposition tool by using a removable etching source that can be installed in specific compartments. This segmentation allows the cleaning capability to be added only where needed (in compartments with disc holding fixtures) while keeping the rest of the tool simple. The modular etching source can be installed or removed based on cleaning requirements, maintaining productivity without permanently increasing overall device complexity.
Solution Approach 2:
The etching source designed in the patent is configured to be installable in multiple compartments of the sputter deposition tool, providing universal cleaning capability across different fixture locations. This multi-functionality allows a single etching source design to serve multiple cleaning purposes throughout the tool, achieving continuous cleaning capability without proportionally increasing device complexity through repeated specialized components.
3Productivity
If the sputter deposition tool operates for prolonged periods, then productivity increases, but contaminants accumulate on disc holding fixtures
Solution Approach 1:
The patent implements continuous cleaning action by integrating the etching source into the sputter deposition tool's operational cycle. The etching source can be activated during idle periods or between deposition runs to continuously clean the disc holding fixtures, ensuring that productivity gains from prolonged operation do not lead to contaminant accumulation. This continuous useful action maintains fixture cleanliness throughout extended production periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plasma etching source efficiently cleans surfaces of disc holding fixtures, ensuring the integrity and performance of sputter deposition processes by removing contaminants, thereby maintaining tool functionality and reducing downtime.
Implementation Method 1
utilizing a high-speed stream of glow discharge plasma to clean surfaces of components by bombarding them with suitable particles
Data Source
AI summary
A plasma etching source installable into at least one of multiple compartments of a sputter deposition tool. The plasma etching source includes a first mounting plate and at least one electrode plate coupled to the first mounting plate. A gas inlet is included in the first mounting plate of the plasma etching source.