Plasma Etching Substrate Heating for By-Product Sublimation
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Solution Overview
Problem
Existing plasma etching methods struggle with by-product removal due to low substrate temperature maintenance, leading to etching defects and inefficiencies in silicon-containing film processing.
Innovation Solution
A plasma processing apparatus that selectively heats the substrate's surface layer using light irradiation while maintaining the underlying layers at a low temperature, facilitated by a light irradiator and temperature monitoring system, to efficiently remove by-products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is maintained at a low temperature during plasma etching, then the etching rate of silicon-containing film is increased, but by-products cannot be efficiently removed
Solution Approach 1:
The patent applies periodic temperature cycling to the substrate during plasma etching. The substrate temperature is alternately adjusted between a first temperature (maintained during plasma generation for efficient by-product removal) and a second temperature (lower temperature that enhances etching rate). This periodic action allows the system to achieve both high etching efficiency and effective by-product removal by switching between optimal temperature conditions for each objective.
2Object-generated harmful factors
If the substrate temperature is increased to remove by-products, then by-product sublimation is improved, but the etching rate decreases
Solution Approach 1:
The patent implements periodic temperature adjustment where the substrate is alternately heated to a first temperature for by-product sublimation and cooled to a second temperature for enhanced etching rate. This time-varying temperature control strategy enables the system to sequentially achieve by-product removal and high-rate etching, resolving the contradiction between these two opposing requirements.
Solution Approach 2:
The patent employs dynamic temperature control of the substrate during the plasma processing sequence. By making the substrate temperature variable rather than static, the system can adapt to different process requirements at different times - high temperature for by-product removal and low temperature for fast etching - thereby achieving both objectives that would be impossible under constant temperature conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances by-product sublimation and promotes efficient etching by allowing immediate cooling post-process, improving productivity and reducing etching defects.
Implementation Method 1
at least one light source configured to temporarily and periodically irradiate a substrate on the substrate support with light to heat the substrate
Implementation Method 2
a temperature of a surface layer of a substrate is increased during plasma generation in a plasma processing apparatus to efficiently remove a by-product
Implementation Method 3
an RF power source configured to supply an RF signal to the antenna in order to generate plasma in the chamber
Implementation Method 4
an antenna disposed above the dielectric window, an RF power source configured to supply an RF signal to the antenna in order to generate plasma
Implementation Method 5
a substrate support disposed in the chamber and including a coolant passage, a coolant supply configured to supply a coolant maintained at a first temperature to the coolant passage
Data Source
AI summary
Provided is a plasma processing apparatus including: a chamber, a substrate support disposed in the chamber and including a coolant passage, a dielectric window disposed above the substrate support, an antenna, an RF power source to supply an RF signal to the antenna, a coolant supply to supply a coolant maintained at a first temperature to the coolant passage, at least one heater disposed in the substrate support, a heater power source to supply power to the at least one heater, at least one light source, a temperature monitor to monitor a temperature of the substrate on the substrate support, and a controller to control, the temperature monitor, the coolant supply, the heater power source, and/or the at least one light source.