Magnetic Field Distribution Prediction for Plasma Etching Tilt Control
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Solution Overview
Problem
Existing plasma etching processes struggle to predict the occurrence of tilting in high aspect ratio patterns due to the oblique incidence of etching ions, which is difficult to control using empirical current adjustments in electromagnets.
Innovation Solution
A correlation is calculated between spatial distribution values of magnetic fields and process results in the plasma etching process, using an information processing apparatus to predict the outcome based on the magnetic field distribution controlled by electromagnets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If empirical current adjustments in electromagnets are used to control ion incidence, then the control process is simple, but the prediction accuracy of tilting occurrence is insufficient
Solution Approach 1:
The patent replaces empirical mechanical/current adjustments with a computational prediction system that uses machine learning models to predict tilting occurrence based on process parameters, eliminating the need for complex trial-and-error current adjustments while improving prediction accuracy
Solution Approach 2:
The patent introduces an information processing apparatus as an intermediary that calculates correlation between electromagnet current values and tilting occurrence, serving as a mediator between the control system and the plasma etching process to enable accurate prediction without direct complex control
2Measurement precision
If spatial distribution values of magnetic fields are used for prediction, then the prediction accuracy improves, but the calculation complexity increases
Solution Approach 1:
The patent extracts only the essential spatial distribution values of magnetic fields that are directly correlated with tilting occurrence, rather than analyzing all magnetic field parameters, thereby maintaining prediction accuracy while reducing calculation complexity
Solution Approach 2:
The patent creates a universal prediction model that can handle various magnetic field configurations and process conditions through a single machine learning framework, making the system adaptable without requiring complex recalculations for different scenarios
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately predicts the tilting distribution and etching rates in plasma etching processes, enhancing precision and control over pattern formation in semiconductor manufacturing.
Implementation Method 1
spatial distribution values of a magnetic field in a plasma processing chamber when a plasma etching process is performed
Implementation Method 2
electromagnets generate a magnetic field
Data Source
AI summary
A prediction method includes a calculation process and a prediction process. The calculation process calculates a correlation between a spatial distribution value of a magnetic field in a chamber when a plasma etching process is performed on a substrate disposed in the chamber, and a process result of the plasma etching process on the substrate. The prediction process predicts the process result of the plasma etching process on the substrate from the spatial distribution value of the magnetic field in the chamber based on the calculated correlation.