Plasma Chamber Exhaust Blade Layout for Uniform Etching
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Solution Overview
Problem
Existing plasma processing apparatuses face issues with asymmetrical gas conductance and impedance distribution in the circumferential direction, leading to variations in processing characteristics such as etching rates across the substrate, which affect uniformity and efficiency.
Innovation Solution
A plasma processing apparatus with a configuration that includes a substrate support, movable and stationary members with alternating blades, a pressure regulating member, and drivers to control the rotation and vertical movement of these components, ensuring symmetrical gas conductance and impedance distribution through precise pressure regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple moving blades and stationary blades are disposed in multiple stages around the substrate support, then gas conductance is improved, but asymmetrical distribution in the circumferential direction causes non-uniform processing characteristics
Solution Approach 1:
The patent applies asymmetry principle by intentionally designing the blade arrangement to be symmetrical with respect to the substrate center. The moving blades and stationary blades are positioned at specific angular intervals (e.g., 90 degrees apart) to create a symmetrical gas conductance distribution pattern, which eliminates the asymmetrical impedance distribution problem and ensures uniform processing characteristics across the substrate surface.
Solution Approach 2:
The patent segments the gas conductance control into multiple independent blade stages. Each stage consists of moving blades and stationary blades that can be independently controlled, allowing precise regulation of gas flow distribution. This segmentation enables symmetrical gas conductance to be achieved by coordinating the operation of multiple segmented blade stages.
2Measurement precision
If moving blades are rotatable and pressure regulating member is movably disposed, then pressure regulation precision is improved, but device complexity increases
Solution Approach 1:
The pressure regulating member serves multiple functions: it regulates pressure, controls gas conductance, and maintains symmetrical distribution. By making this single component movable and multi-functional, the patent achieves precise pressure regulation without proportionally increasing overall device complexity. The first driver rotates the movable member while the second driver moves the pressure regulating member, allowing coordinated control of multiple parameters through a unified structure.
Solution Approach 2:
The patent introduces dynamic elements (movable blades, rotatable movable member, movably disposed pressure regulating member) to achieve precise pressure regulation. These dynamic components can adjust their positions and orientations to optimize gas conductance and pressure distribution in real-time, enabling precise control while maintaining a relatively compact structure through coordinated movement rather than adding multiple static components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform substrate processing by maintaining symmetrical gas conductance and impedance, reducing variations in processing characteristics, and enhancing exhaust efficiency, resulting in more uniform and precise substrate treatment.
Implementation Method 1
a plasma processing chamber
Data Source
AI summary
A plasma processing apparatus includes a plasma processing chamber; a substrate support disposed in the plasma processing chamber; a movable member and a stationary member each disposed around the substrate support, the movable member having a plurality of moving blades, the plurality of moving blades being rotatable, the stationary member having a plurality of stationary blades, the plurality of moving blades and the plurality of stationary blades being alternately disposed along a height direction of the plasma processing chamber, and an exhaust space being formed beneath the movable member and the stationary member; a first driver configured to rotate the movable member; a pressure regulating member movably disposed around the substrate support and above the movable member and the stationary member; and a second driver configured to move the pressure regulating member.