3D Printer Plasma Field Applicator for Layer Bonding
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Solution Overview
Problem
Current three-dimensional printing processes are limited in producing parts with high cohesive strength and multifunctional capabilities, often resulting in distortion and residual stresses due to heating methods used to enhance layer bonding.
Innovation Solution
A three-dimensional printing apparatus featuring a controller, print head, part carrier, and plasma field applicator that generates an electromagnetic field and induced current pathway, using a high potential alternating current signal to improve layer bonding without causing distortion, with the plasma field applicator comprising a high voltage electrode encapsulated by a dielectric insulator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heating methods are used to enhance layer bonding in three-dimensional printing, then cohesive strength between layers is improved, but distortion and residual stresses occur
Solution Approach 1:
The patent replaces thermal heating methods with electromagnetic field induction. The plasma field applicator generates an electromagnetic field that induces eddy currents in the conductive printed part, converting electromagnetic energy directly into localized thermal energy only where needed for bonding, rather than heating the entire part thermally. This substitution of heating mechanism resolves the contradiction by achieving layer bonding without global thermal distortion.
Solution Approach 2:
The patent changes the fundamental parameter of energy delivery from conventional thermal conduction/heating to electromagnetic induction. By using a plasma field applicator that generates high-frequency electromagnetic fields (typically 27.12 MHz or similar), the system induces eddy currents that generate heat locally at the bonding interface through resistive heating, rather than applying external thermal energy to the entire part. This parameter change enables precise localized heating without the distortion associated with global thermal processing.
2Strength
If conventional heating processes are applied to improve layer bonding, then cohesive strength increases, but sagging and residual stresses are introduced
Solution Approach 1:
The patent substitutes conventional thermal processing with electromagnetic induction heating. The plasma field applicator generates electromagnetic fields that induce eddy currents within the conductive printed material, converting electromagnetic energy to thermal energy locally at the bonding interface. This eliminates the need for external heating sources that cause sagging and residual stresses, while still achieving the necessary temperature for layer bonding and cohesive strength enhancement.
Solution Approach 2:
The patent applies electromagnetic energy segmentation by targeting specific regions of the printed part for heating. The plasma field applicator can be positioned to induce eddy currents only at the bonding interface between layers, rather than heating the entire part. This localized energy application achieves cohesive strength improvement without introducing harmful effects like sagging in non-bonding regions or residual stresses from uniform thermal expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the cohesive strength and dimensional stability of printed parts, enabling them for a broader range of applications beyond prototypes and light-duty uses by directly coupling the electromagnetic field to the part, reducing sagging and residual stresses.
Implementation Method 1
The signal generator is configured to output a signal to the plasma field applicator and the plasma field applicator is configured to generate an electromagnetic field and induced current pathway incident to the three-dimensional object on the part carrier
Implementation Method 2
the plasma field applicator is configured to generate an electromagnetic field and induced current pathway incident to the three-dimensional object on the part carrier
Data Source
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AI summary
A three-dimensional printing apparatus for manufacturing a three- dimensional object includes a controller and a three-dimensional printer. The controller has a signal generator. The three-dimensional printer includes a print head, a part carrier, and a plasma field applicator. The plasma field applicator is disposed on an end of the print head. The controller is in communication with the print head, part carrier, and plasma field applicator. The three dimensional printer builds the three-dimensional object onto the part carrier. The signal generator outputs a signal to the plasma field applicator and the plasma field applicator generates an electromagnetic field and induced current pathway incident to the three-dimensional object on the part carrier.