Plasma Gas Supply Switching with Bypass Pressure Stabilization

Solution Overview

Problem

The challenge of manufacturing highly integrated semiconductor devices is exacerbated by the difficulty in maintaining uniform plasma density and suppressing pressure fluctuations during gas switching in plasma processing apparatuses, leading to increased process time and reduced productivity.

Innovation Solution

A gas supply device with multiple flow ratio controllers, switching valves, and a conductance control valve is employed to swiftly switch processing gases and stabilize chamber pressure, ensuring uniform plasma density and efficient gas distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If processing gas is switched rapidly to improve productivity, then process time is reduced, but pressure fluctuations in the chamber increase

Engineering Contradiction:

Improveprocess timeVSAvoidchamber pressure stability

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The bypass pipe is pre-configured and maintained in an open state before gas switching occurs. This allows the system to prepare the gas flow path in advance, enabling rapid switching between processing gases without causing pressure fluctuations in the chamber.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The bypass pipe acts as an intermediary gas flow path that mediates between the gas source and the chamber. During gas switching, the bypass pipe provides a alternative route that prevents direct pressure changes from reaching the chamber, thus stabilizing chamber pressure while enabling rapid gas replacement.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If conventional gas switching is used to maintain stable pressure, then pressure stability is preserved, but process time increases and productivity decreases

Engineering Contradiction:

Improvechamber pressure stabilityVSAvoidprocess time

Core Design Contradiction:

Stability of the object's compositionVSProductivity

Solution Approach 1:

The bypass pipe is pre-configured and maintained in an open state before gas switching occurs. This allows the system to prepare the gas flow path in advance, enabling rapid switching between processing gases without causing pressure fluctuations in the chamber.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The bypass pipe acts as an intermediary gas flow path that mediates between the gas source and the chamber. During gas switching, the bypass pipe provides a alternative route that prevents direct pressure changes from reaching the chamber, thus stabilizing chamber pressure while enabling rapid gas replacement.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If multiple processing gases are switched frequently to perform multiple processes, then process versatility is improved, but pressure fluctuations and process time increase

Engineering Contradiction:

Improveprocess versatilityVSAvoidprocess time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The bypass pipe is pre-configured and maintained in an open state before gas switching occurs. This allows the system to prepare the gas flow path in advance, enabling rapid switching between processing gases without causing pressure fluctuations in the chamber.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The bypass pipe acts as an intermediary gas flow path that mediates between the gas source and the chamber. During gas switching, the bypass pipe provides a alternative route that prevents direct pressure changes from reaching the chamber, thus stabilizing chamber pressure while enabling rapid gas replacement.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12620559B2Gas supply device and plasma processing apparatus

Publication Date: 2026.05.05 SAMSUNG ELECTRONICS CO LTD

AI summary

A gas supply device includes a plurality of flow ratio controllers configured to output a plurality of processing gases supplied from a gas box according to respective predetermined flow ratios; a plurality of switching valve sets connecting the plurality of flow ratio controllers to a plurality of supply pipes connected to a plurality of regions in a chamber or to a bypass pipe; a conductance control valve configured to control conductance of the bypass pipe; and a controller configured to control a processing gas output by one of the plurality of flow ratio controllers to be discharged through the bypass pipe, while a processing gas output by another of the plurality of flow ratio controllers is supplied to the plurality of regions in the chamber, wherein the controller is configured to control the conductance control valve when a processing gas supplied to the plurality of regions is switched.