Plasma Generator Synthetic Quartz Oxygen Extraction Resistance
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Solution Overview
Problem
Plasma processing apparatuses face damage due to plasma sputtering and etching, particularly in regions with high oxygen reactivity, leading to stress and structural changes in silica glass components, which affects the longevity and efficiency of the equipment.
Innovation Solution
The plasma processing apparatus employs a plasma generator with a hollow protrusion formed of synthetic quartz, which has a higher concentration of silanol groups, reducing oxygen extraction and stress, while other components are made of natural quartz to minimize material costs and enhance durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If natural quartz is used for the plasma generator, then material cost is reduced, but the component is susceptible to damage from plasma sputtering and etching
Solution Approach 1:
The patent applies different materials to different regions of the plasma generator based on their specific functional requirements and exposure to plasma. The reaction chamber is made of synthetic quartz for durability, while the exhaust chamber uses natural quartz for cost-effectiveness, creating a differentiated material structure that optimizes both performance and cost.
Solution Approach 2:
The plasma generator is constructed as a composite structure combining synthetic quartz and natural quartz materials. This composite approach allows the system to leverage the high durability of synthetic quartz in plasma-exposed regions while utilizing the cost advantages of natural quartz in less critical areas, achieving an optimal balance between reliability and manufacturing cost.
2Reliability
If synthetic quartz is used for the plasma generator, then resistance to plasma-induced damage is improved, but material cost increases
Solution Approach 1:
The patent applies different materials to different regions of the plasma generator based on their specific functional requirements and exposure to plasma. The reaction chamber is made of synthetic quartz for durability, while the exhaust chamber uses natural quartz for cost-effectiveness, creating a differentiated material structure that optimizes both performance and cost.
Solution Approach 2:
The plasma generator is constructed as a composite structure combining synthetic quartz and natural quartz materials. This composite approach allows the system to leverage the high durability of synthetic quartz in plasma-exposed regions while utilizing the cost advantages of natural quartz in less critical areas, achieving an optimal balance between reliability and manufacturing cost.
3Productivity
If silica glass components are exposed to high oxygen reactivity plasma, then plasma processing efficiency is maintained, but stress and structural changes occur in the silica glass
Solution Approach 1:
The patent changes the material parameter of the reaction chamber from natural quartz to synthetic quartz, which has different chemical composition and structural properties. Synthetic quartz has higher purity and different silanol group concentration, making it more resistant to oxygen extraction and stress generation during plasma processing, thus maintaining structural stability while preserving plasma processing efficiency.
Solution Approach 2:
The plasma generator is constructed as a composite structure combining synthetic quartz and natural quartz materials. This composite approach allows the system to leverage the high durability of synthetic quartz in plasma-exposed regions while utilizing the cost advantages of natural quartz in less critical areas, achieving an optimal balance between reliability and manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the maximum principal stress and etching amount on silica glass surfaces, leading to improved resistance against plasma-induced damage and extended equipment lifespan, while maintaining cost-effectiveness.
Implementation Method 1
Plasma processing apparatuses face damage due to plasma sputtering and etching
Implementation Method 2
Plasma processing apparatuses face damage due to plasma sputtering and etching
Data Source
AI summary
A plasma processing apparatus includes a plasma generator provided with a plasma electrode and performs plasma processing on a substrate accommodated in a processing container. At least a region corresponding to the plasma electrode of the plasma generator is formed of synthetic quartz.


