Localized Plasma Heating Structure for Crack-Free Substrate Edges
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Solution Overview
Problem
Conventional substrate heating technologies face challenges in locally heating substrates at high temperatures without causing thermal stress cracking due to temperature differences, leading to inefficient production and low yield.
Innovation Solution
A localized heating device and system utilizing a plasma deforming portion with a circular inlet and elongated outlet, combined with a slot-type heating portion, allow for high-speed, high-temperature plasma treatment of substrates while maintaining other parts at room temperature, preventing thermal stress cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the heating temperature is increased to improve processing efficiency, then the heating speed and property change rate increase, but temperature differences cause thermal stress cracking in the substrate
Solution Approach 1:
The patent applies local quality by concentrating plasma heating only at the edge region of the substrate rather than heating the entire substrate. The plasma generating device is positioned to deliver energy selectively to the edge area, creating a localized high-temperature zone that achieves rapid heating and property modification without inducing thermal stress cracking in the bulk substrate.
Solution Approach 2:
The patent segments the heating process by dividing the substrate into different thermal zones: the edge region receives intensive plasma heating while the central region remains at ambient or lower temperature. This spatial segmentation of thermal treatment allows the edge to be rapidly heated to desired temperatures without creating excessive temperature gradients across the entire substrate that would cause thermal stress.
2Strength
If conventional high temperature pressing is used for substrate bonding, then bonding strength is achieved, but the process is time-consuming and energy-consuming with poor production efficiency
Solution Approach 1:
The patent replaces the conventional mechanical pressing system with a plasma-based heating system. Instead of using high temperature pressing for 2-4 hours, the plasma generating device delivers rapid localized heating to the edge region, achieving bonding or property modification in a fraction of the time. This substitution of mechanical/thermal process with plasma processing dramatically improves production efficiency while maintaining bonding strength.
Solution Approach 2:
The patent applies preliminary action by pre-heating or pre-treating the edge region of the substrate using plasma before the actual bonding or processing step. This preliminary plasma treatment prepares the edge area with appropriate temperature and surface properties, enabling subsequent bonding to occur rapidly without requiring prolonged high temperature pressing of the entire substrate.
3Stability of the object's composition
If the entire substrate is heated for bonding process, then uniform heating is achieved, but other parts of the substrate are damaged or cracked due to temperature differences
Solution Approach 1:
The patent applies local quality by concentrating plasma heating only at the edge region of the substrate rather than heating the entire substrate. The plasma generating device is positioned to deliver energy selectively to the edge area, creating a localized high-temperature zone that achieves rapid heating and property modification without inducing thermal stress cracking in the bulk substrate.
Solution Approach 2:
The patent extracts the heating function from the bulk substrate treatment and applies it only where needed at the edge region. By taking out the heating action from a global process and making it localized, the patent achieves the desired thermal effect at the edge while avoiding thermal damage to the remaining substrate areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and energy-saving localized heating of substrates, preventing thermal stress cracking and improving production efficiency by allowing precise control over heating temperatures and regions.
Implementation Method 1
a plasma producing source; a plasma deforming portion, including: an inlet end, having a circular hole, connected with a plasma producing source
Implementation Method 2
a plasma flow provided by the plasma producing source being to enter the channel via the circular hole, then to flow through the elongated hole, and finally to reach the slot
Data Source
AI summary
A localized heating device includes a plasma deforming portion and a heating portion. The plasma deforming portion includes an inlet end having a circular hole, an outlet end having an elongated hole with a first length and a first width, and a channel smoothly connected with the circular hole and the elongated hole. The heating portion, disposed at the outlet end, includes two control covers spaced by a slot. The elongated hole and the slot being oppositely disposed with respect to the plasma deforming portion. A plasma flow provided by a plasma producing source being to enter the channel via the circular hole, then to flow through the elongated hole, and finally to reach the slot.