Plasma Surface Modification With Humidity Control for Substrate Bonding
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Solution Overview
Problem
The decrease in bonding strength between substrates due to the gradual reduction of moisture in the processing vessel during surface modification processes, leading to inadequate plasma state changes and potential delamination issues.
Innovation Solution
A surface modifying method that adjusts the moisture level in the processing vessel by supplying a humidified gas, ensuring the plasma state is maintained optimally during the modification of bonding surfaces, thereby suppressing the decrease in bonding strength between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface modification is performed by plasma in a processing vessel, then substrate bonding strength is improved through hydrophilization, but moisture in the processing vessel gradually reduces leading to decreased bonding strength
Solution Approach 1:
The patent applies preliminary action by adjusting the moisture content in the processing vessel before performing plasma surface modification. By pre-establishing the appropriate moisture environment, the method ensures optimal bonding strength is achieved during the subsequent plasma treatment, preventing the gradual reduction of bonding strength that occurs when moisture is not properly controlled from the outset.
Solution Approach 2:
The patent implements parameter changes by actively controlling and adjusting the moisture content parameter in the processing vessel during plasma surface modification. This involves monitoring and regulating the water vapor concentration to maintain it within a specific range, thereby optimizing the plasma treatment conditions and ensuring consistent bonding strength throughout the process.
2Stability of the object's composition
If plasma processing gas is used for surface modification, then substrate surfaces are hydrophilized, but nitridated portions form on substrate surfaces reducing bonding quality
Solution Approach 1:
The patent applies parameter changes by controlling the moisture content parameter to suppress the formation of nitridated portions on substrate surfaces. By adjusting the water vapor concentration in the processing vessel during plasma treatment, the method modifies the chemical environment to favor hydrophilization while minimizing unwanted nitrogen incorporation into the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively maintains the bonding strength by reducing the formation of nitridated portions on the substrate surfaces, allowing for stable hydrogen bonding and van der Waals forces, thus preventing delamination and ensuring robust substrate bonding.
Implementation Method 1
modifies the surface of the accommodated substrate with plasma of a processing gas
Implementation Method 2
supplying a humidified gas into the processing vessel
Implementation Method 3
the modified surfaces of the substrates are hydrophilized, and the hydrophilized substrates are bonded by a Van der Waals force and a hydrogen bond
Implementation Method 4
the hydrophilized substrates are bonded by a Van der Waals force and a hydrogen bond
Data Source
AI summary
A surface modifying method of modifying a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas includes an adjusting process and a modifying process. In the adjusting process, an amount of moisture in a processing vessel is adjusted by supplying a humidified gas into the processing vessel allowed to accommodate the substrate therein. In the modifying process, the bonding surface of the substrate is modified by forming the plasma of the processing gas in the processing vessel in a state that the amount of moisture in the processing vessel is adjusted.