Plasma Ion Source Compact Cooling via Dielectric Chamber and Insulating Liquid
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Solution Overview
Problem
Conventional plasma ion sources experience increased size due to the need for cooling, which compromises their efficiency and compactness.
Innovation Solution
A plasma ion source design incorporating a dielectric plasma generation chamber, a coil wound around the chamber, and insulating liquid within an envelope to efficiently cool the coil and maintain compactness, while using a high-frequency power source to prevent size expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling fluid channel is provided around the plasma generation chamber to cool the wall portion, then the cooling performance is improved, but the entire size of the plasma ion source increases to several times that of the plasma generation chamber
Solution Approach 1:
The plasma generation chamber is nested within the cooling fluid channel, with the chamber positioned inside the channel structure. This allows the cooling system to surround and cool the plasma chamber effectively while maintaining a compact overall configuration, avoiding the need for external cooling structures that would increase the apparatus size.
Solution Approach 2:
The cooling fluid channel is integrated with the plasma generation chamber structure, combining the cooling function with the plasma generation components. This merging of functions eliminates the need for separate external cooling systems, thereby improving cooling performance without significantly increasing the overall apparatus volume.
2Power
If high-frequency power is applied to the coil, then plasma generation is improved, but the coil is easily heated requiring additional cooling structures
Solution Approach 1:
The coil is positioned within the cooling fluid channel structure, nesting the heating component inside the cooling system. This allows the cooling fluid to flow directly around the coil, efficiently removing heat generated during high-frequency power application without requiring external cooling structures.
3Power
If the plasma generation chamber is made of dielectric material, then plasma generation is improved, but the chamber wall temperature easily increases due to contact with high-density plasma
Solution Approach 1:
The dielectric plasma generation chamber is nested within the cooling fluid channel, allowing the cooling fluid to flow around and cool the chamber walls. This maintains the benefits of dielectric material for plasma generation while preventing excessive wall temperature increase through direct cooling contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the overall size increase of the plasma ion source, enhances cooling performance, and allows for efficient high-frequency power application, maintaining apparatus compactness and efficiency.
Implementation Method 1
insulating liquid filled inside the gas introduction chamber, the plasma generation chamber and the envelope to immerse the coil
Implementation Method 2
cooling fluid channel is provided around a plasma generation chamber in order to cool a wall portion
Implementation Method 3
a coil which is easily heated by applying high-frequency power
Implementation Method 4
a plasma generation chamber connected to the gas introduction chamber and made of a dielectric material
Data Source
AI summary
A plasma ion source includes: a gas introduction chamber, into which raw gas is introduced; a plasma generation chamber connected to the gas introduction chamber and made of a dielectric material; a coil wound along an outer circumference of the plasma generation chamber and to which high-frequency power is applied; an envelope surrounding the gas introduction chamber, the plasma generation chamber and the coil; and insulating liquid filled inside the gas introduction chamber, the plasma generation chamber and the envelope to immerse the coil and having an dielectric strength voltage relatively greater than that of the envelope and the same dielectric dissipation factor as the plasma generation chamber.