Atmospheric Plasma Jet Deposition for 3D Printed Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current metallization techniques for 3D interconnects and flexible electronics are substrate-dependent, requiring multiple processes for different materials and applications, and lack the ability to tailor physical, chemical, and electronic properties, especially for low glass transition temperature plastics and porous structures needed for high throughput processing.
Innovation Solution
A substrate-independent atmospheric pressure plasma jet deposition process that uses an aerosol containing conducting materials, delivered through nozzles connected to a high voltage power supply, allowing for in situ control of morphological and chemical modification of materials during and after deposition, enabling tailored physical, chemical, and mechanical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional metallization techniques are used, then deposition on specific substrates is achieved, but the process is substrate-dependent and requires multiple different processes for different materials
Solution Approach 1:
The plasma jet deposition process is designed to work with multiple substrate types (flexible plastics, low glass transition temperature materials, porous structures) using a single unified process, eliminating the need for multiple specialized deposition techniques for different substrates
Solution Approach 2:
The process enables in situ control of deposition parameters including morphology, porosity, and oxidation state through plasma process parameters, allowing the same deposition process to produce different material properties for different applications without changing the fundamental process
2Manufacturing precision
If inkjet printing with copper nanoparticles is used, then conductive patterns are printed, but post deposition annealing is required which limits low glass transition temperature plastics and adds processing steps
Solution Approach 1:
The plasma jet deposition process combines material deposition and post-deposition treatment (annealing, oxidation control) into a single integrated process step, eliminating the need for separate post-deposition annealing that would be required by inkjet printing methods
Solution Approach 2:
The plasma process enables control of material properties through plasma parameters rather than thermal annealing, allowing deposition on low glass transition temperature plastics that would be damaged by high-temperature post-deposition treatment
3Ease of manufacture
If screen printing is used, then planar objects are printed, but resolution is limited and organic contaminants are present requiring post print thermal treatment
Solution Approach 1:
The plasma jet deposition process replaces the mechanical screen printing method with a plasma-based deposition process, enabling higher resolution patterns without the limitations of screen mesh geometry and eliminating organic contaminants from screen printing materials
4Productivity
If thermal spray is used, then industrial coating is achieved, but high oxygen concentration and high porosity result in difficulty controlling microstructure
Solution Approach 1:
The plasma jet deposition process enables precise control of microstructure parameters including porosity and oxidation state through adjustment of plasma process parameters, overcoming the inability of thermal spray to control microstructure despite its high productivity
5Manufacturing precision
If thermal annealing is used for copper oxidation, then oxide derived nano crystalline copper surface is achieved, but additional processing steps are required
Solution Approach 1:
The plasma jet deposition process combines copper deposition and oxidation into a single process step by controlling the plasma chemistry, eliminating the need for separate thermal annealing steps required to create oxide-derived nano crystalline copper surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process allows for the deposition of conducting materials with tailored properties on various substrates, including flexible electronics and 3D printed components, enhancing interconnect performance and electrocatalysis efficiency by controlling morphology, porosity, and oxidation state, while reducing the need for additional post-processing steps.
Implementation Method 1
A substrate-independent atmospheric pressure plasma jet deposition process that uses an aerosol containing conducting materials, delivered through nozzles connected to a high voltage power supply
Implementation Method 2
allowing for in situ control of morphological and chemical modification of materials during and after deposition
Data Source
AI summary
Systems and methods for highly reproducible and focused plasma jet printing and patterning of materials using appropriate ink containing aerosol through nozzles with narrow orifice and tubes with controlled dielectric constant connected to high voltage power supply, in the presence of electric field and plasma, that enables morphological and/or bulk chemical modification and/or surface chemical modification of the material in the aerosol and/or the substrate prior to printing, during printing and post printing.