Plasma Jet Print Head for Directional 3D Electronics
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Solution Overview
Problem
Current 3D printing technologies face challenges in integrating electronic materials with varying thermal, electronic, mechanical, and chemical characteristics into complex 3D structures, limited by gravity-based printing methods that restrict directional control and require high temperatures, leading to inefficient and low-resolution electronic component deposition.
Innovation Solution
A dielectric barrier atmospheric pressure plasma jet system integrated with 3D printing allows for non-gravity based directional printing of electronic materials, enabling precise thickness and aspect ratio control, and low-temperature deposition on diverse substrates, including plastics and ceramics, using a combination of electric field and plasma for fluid directionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If gravity-based printing methods are used, then material deposition is simple, but directional control is restricted and complex 3D patterns cannot be printed on side walls or complex objects
Solution Approach 1:
The patent replaces gravity-based material deposition with an electric field-based system. Charged particles are accelerated and directed using electric fields generated by electrodes, allowing precise control of material placement in three-dimensional space regardless of orientation. This substitution enables printing on complex 3D objects including side walls and surfaces that would be inaccessible to gravity-based methods.
2Reliability
If high temperature processes like plasma spray are used, then electronic materials can be deposited, but low glass transition temperature plastics cannot be processed
Solution Approach 1:
The patent extracts the thermal component from the deposition process by using electric field acceleration of charged particles instead of thermal plasma spray. The kinetic energy of accelerated ions and particles provides the necessary energy for deposition without requiring high substrate temperatures, enabling processing of temperature-sensitive materials like low glass transition temperature plastics while still achieving reliable electronic material deposition.
Solution Approach 2:
The patent changes the energy delivery parameter from thermal energy (high temperature plasma) to kinetic energy (electric field accelerated particles). This parameter change allows deposition of electronic materials at low substrate temperatures by controlling the acceleration voltage and particle flux, making the process compatible with plastics and other temperature-sensitive substrates.
3Quantity of substance
If inkjet or aerosol printing is used, then material deposition is achievable, but post deposition thermal treatment is required which causes void formation and affects film quality
Solution Approach 1:
The patent converts the harmful effect of organic binders and solvents into a benefit by using charged particles that can be directly deposited without requiring thermal treatment for removal. The electric field enables direct deposition of functional materials, and any organic components can be selectively removed or modified by controlled plasma treatment that does not cause void formation, thereby improving film quality while maintaining material deposition capability.
4Area of stationary object
If conventional printing methods are used, then planar objects can be printed, but conformal deposition on uneven surfaces and complex 3D patterns is difficult
Solution Approach 1:
The patent transitions from two-dimensional planar printing to three-dimensional conformal printing by using electric fields that can be applied in multiple directions. The charged particles follow field lines that can be shaped to conform to complex 3D surfaces, enabling uniform deposition on uneven surfaces and complex geometries that cannot be achieved with conventional planar printing methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables scalable, efficient, and reproducible deposition of conductive and insulating materials on complex 3D objects with precise control over film thickness and resolution, overcoming limitations of existing technologies by allowing in-situ integration of electronics within the 3D printing process and maintaining spatial resolution.
Implementation Method 1
a plasma jet print head configured for directional acceleration of materials in a geometric pattern by a combination of dielectric tube with one end of it connected to a manifold containing electrode, gas supply and aerosol supply
Implementation Method 2
a plasma jet print head configured for directional acceleration of materials in a geometric pattern by a combination of dielectric tube with one end of it connected to a manifold containing electrode, gas supply and aerosol supply, other end of the tube connected to a nozzle that is either part of the tube or a detachable module with defined orifice, multiple electrodes disposed over the dielectric tube and gas supply for igniting a dielectric barrier discharge
Implementation Method 3
non-gravity based directional printing of electronic materials, enabling precise thickness and aspect ratio control, and low-temperature deposition on diverse substrates, including plastics and ceramics, using a combination of electric field and plasma for fluid directionality
Data Source
AI summary
A device and method for printing 3D articles including electronic and functional elements including 3D printer and a plasma jet printer based on a dielectric barrier atmospheric pressure plasma jet system in which both printing and in-situ treatment and post-deposition treatment can be carried out to tailor the materials characteristics. Plasma jet printer comprising of electrodes in the nozzle/print head for applying electric field and generating atmospheric plasma that could be used for non-gravity based highly directional printing in any direction. Integration of dielectric barrier plasma printer and plasma treatment jets with the 3D printer increases the capability of embedding high performance electronics in a 3D printed structure aiding in additive manufacturing of functional devices. Ability to use a range of materials for print head assembly including micro machined silicon increases the resolution of the plasma jet printer to sub-micron level.