Plasma System Malfunction Detection via Electrical Modeling
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Solution Overview
Problem
Plasma systems face challenges in detecting malfunctions without relying on expensive sensors, as existing methods often require costly metrology tools to measure voltage at the output of impedance matching circuits.
Innovation Solution
A system and method that utilize a computing device to determine if a plasma module operates within constraints by comparing a measured value at the output of the power delivery portion with a pre-recorded value, using a known load and pre-set formulas, to identify malfunctions between the input and output of the power delivery portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If expensive sensors are used to measure voltage at the output of impedance matching circuits, then measurement precision is improved, but device cost increases
Solution Approach 1:
The patent creates an electrical model that copies the behavior of the impedance matching circuit and plasma module. By measuring voltage at the RF generator output and using the pre-stored electrical model, the system calculates what the voltage should be at the plasma module input without physically measuring it there. This virtual copy replaces the need for expensive sensors at the plasma module while maintaining measurement precision.
Solution Approach 2:
The patent introduces an electrical model as an intermediary between the RF generator and plasma module. Instead of directly measuring voltage at the difficult-to-access plasma module output, the system uses the electrical model to mediate and calculate the voltage based on measurements taken at the RF generator output, which is easily accessible and requires only inexpensive sensors.
2Reliability
If sensors are installed at every plasma processing tool, then measurement reliability is improved, but device complexity increases
Solution Approach 1:
The patent creates a universal electrical model that can be applied to any plasma processing tool with an impedance matching circuit. The same modeling approach and calculation methodology works across different tools and configurations, allowing reliable malfunction detection without installing tool-specific sensors at each location. The electrical model serves multiple measurement needs across the entire plasma processing system.
Solution Approach 2:
Instead of installing physical sensors at each plasma processing tool, the patent creates virtual copies through electrical models for each tool configuration. These modeled representations allow the system to monitor and detect malfunctions across multiple tools using centralized measurements and calculations, reducing the need for duplicate sensor installations while maintaining detection reliability.
3Measurement precision
If voltage is measured directly at the plasma module input, then measurement precision is improved, but ease of operation worsens due to sensor cost and installation difficulty
Solution Approach 1:
The patent inverts the traditional measurement approach by measuring voltage at the RF generator output (the source) rather than at the plasma module input (the load). By measuring at the easily accessible RF generator and using the electrical model to calculate the voltage at the plasma module, the system achieves the same measurement precision without the operational difficulties of installing sensors at the plasma module.
Solution Approach 2:
The electrical model acts as an intermediary that translates the easily-measured voltage at the RF generator output into the voltage at the plasma module input. This mediator allows the system to obtain precise voltage information at the plasma module without physically placing sensors there, combining the ease of measuring at the RF generator with the need for plasma module voltage information.
Data Source
AI summary
Systems and methods for determining a malfunctioning device in a plasma system, are described. One of the methods includes receiving an indication whether plasma is generated within a plasma chamber of the plasma system. The plasma system includes a processing portion and a power delivery portion. The method further includes determining whether the plasma system operates within constraints in response to receiving the indication that the plasma is generated, determining a value of a variable at an output of the power delivery portion when the processing portion is decoupled from the power delivery portion, and comparing the determined value with a pre-recorded value of the variable. The method includes determining whether the determined value is outside a range of the pre-recorded value and determining that the malfunctioning device within the power delivery portion upon determining that the determined value is outside the range of the pre-recorded value.