Plasma Processing Manifold Evacuation Path Optimization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plasma processing apparatuses face reduced evacuation efficiency due to the long distance gas molecules must travel to reach the vacuum pump, especially in high vacuum states, and are not suitable for small-sized processing apparatuses.
Innovation Solution
A plasma processing apparatus with a manifold portion having a flow-path effective cross-sectional area larger than the opening, directly connecting the intake port of the vacuum pump to the manifold portion, and an opening and closing mechanism with a valve body in the manifold portion to minimize distance and maximize the probability of gas molecules reaching the vacuum pump.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If gas molecules travel through a long path to reach the vacuum pump, then the apparatus can be compact, but the evacuation efficiency deteriorates in high vacuum states
Solution Approach 1:
The patent changes the spatial arrangement from a linear path to a radial/direct path configuration. The opening in the manifold portion allows gas molecules to travel directly toward the vacuum pump intake port rather than following a long curved path through the chamber, effectively utilizing dimensional optimization to shorten the mean free path.
Solution Approach 2:
The patent extracts the critical evacuation function from the complex chamber geometry and concentrates it in the manifold portion with the opening. By isolating and emphasizing this specific evacuation pathway, the system achieves efficient gas removal without requiring the entire apparatus to be large.
2Productivity
If the manifold portion has a large flow-path effective cross-sectional area, then the evacuation efficiency improves, but the apparatus complexity increases
Solution Approach 1:
The manifold portion serves multiple functions: it acts as a gas distribution network, provides structural support, and creates the optimized evacuation pathway through its opening. This multi-functionality allows the structure to achieve large effective cross-sectional area for evacuation without adding separate dedicated components.
Solution Approach 2:
The patent merges the manifold structure with the evacuation pathway by incorporating the opening directly into the manifold portion. This integration eliminates the need for separate evacuation channels or additional components, achieving simplified structure with large effective cross-sectional area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances evacuation efficiency by increasing the probability of gas molecules reaching the vacuum pump, allowing for efficient high vacuum state control and enabling the creation of compact, small-sized plasma processing apparatuses capable of handling substrates up to 1 inch in diameter.
Implementation Method 1
the inside of the processing chamber is kept in a vacuum state by exhausting gas in the processing chamber
Implementation Method 2
generates plasma from the processing gas supplied into the plasma generating portion
Implementation Method 3
a coil power supply mechanism for supplying RF power to the coil
Data Source
AI summary
A plasma etching apparatus 1 includes a processing chamber 2 having a plasma generating portion 3, a processing portion 4, an exhaust portion 5, and a manifold portion 6 defined inside, and an exhaust mechanism 30 for exhausting gas in the processing chamber 2, the exhaust mechanism 30 is composed of a vacuum pump 31 having an intake port connected to an opening 8, a valve body 32 inserted through an opening 9, and a moving mechanism 34 for moving the valve body 32 in upward and downward directions, and the intake port of the vacuum pump 31 is connected to the opening 8 which is formed in a third chamber 2c forming a part of the processing chamber 2.