Plasma Mold Cleaning Control to Prevent Particle Adhesion
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Solution Overview
Problem
Conventional cleaning apparatuses in imprint technology face issues with fine particles generated from electrodes or dielectric bodies adhering to substrates or apparatus components during plasma irradiation, leading to defects in pattern formation.
Innovation Solution
A cleaning apparatus with a plasma irradiating portion and a controlling unit that adjusts the relative position between the plasma and the mold to prevent particle adhesion, using atmospheric pressure plasma and inert gas purging to enhance cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plasma irradiation is performed to clean the mold, then cleaning effectiveness is improved, but fine particles are generated and adhere to the substrate or apparatus components
Solution Approach 1:
The patent applies preliminary action by performing plasma irradiation in advance on a dummy substrate or sacrificial surface before the actual substrate processing. This pre-irradiation step generates and removes fine particles beforehand, preventing them from adhering to the actual substrate during subsequent plasma cleaning operations. The dummy substrate acts as a sacrificial target that absorbs the particle-generating plasma effects.
Solution Approach 2:
The patent introduces a dummy substrate or sacrificial surface as an intermediary between the plasma source and the actual substrate. This intermediary component absorbs the harmful particle-generating plasma effects while protecting the actual substrate. The dummy substrate serves as a mediator that takes the place of the real substrate during the particle-generating phase of plasma irradiation.
2Manufacturing precision
If the mold is cleaned periodically to remove cured resin, then pattern quality is improved, but processing time is increased
Solution Approach 1:
The patent implements continuous useful action by integrating plasma irradiation cleaning into the regular substrate processing flow without requiring separate periodic cleaning cycles. The plasma irradiation is performed continuously during normal operations, maintaining mold cleanliness and pattern quality without interrupting the manufacturing process for dedicated cleaning periods.
Solution Approach 2:
The patent replaces mechanical or chemical cleaning methods with plasma irradiation technology. This substitution enables non-contact, non-intrusive cleaning that can be performed rapidly during substrate processing, eliminating the need for time-consuming manual or chemical cleaning procedures while maintaining high pattern quality.
3Reliability
If plasma irradiation is performed with the mold in position, then cleaning is effective, but fine particles from electrode or dielectric body adhere to the mold surface
Solution Approach 1:
The patent applies preliminary action by performing plasma irradiation in advance on a dummy substrate or sacrificial surface before the actual substrate processing. This pre-irradiation step generates and removes fine particles beforehand, preventing them from adhering to the actual substrate during subsequent plasma cleaning operations. The dummy substrate acts as a sacrificial target that absorbs the particle-generating plasma effects.
Solution Approach 2:
The patent introduces a dummy substrate or sacrificial surface as an intermediary between the plasma source and the actual substrate. This intermediary component absorbs the harmful particle-generating plasma effects while protecting the actual substrate. The dummy substrate serves as a mediator that takes the place of the real substrate during the particle-generating phase of plasma irradiation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient removal of foreign matter from molds without causing particle deposition, thereby reducing defects in pattern transfer and improving cleaning efficiency.
Implementation Method 1
a plasma irradiating portion (13) for irradiating plasma (8)
Data Source
AI summary
A cleaning apparatus for cleaning an original with plasma includes a stage for holding the original, a plasma irradiating portion for irradiating plasma, a driving unit for adjusting a relative position of the stage and the plasma irradiating portion, and a controlling unit configured to control the plasma irradiating portion and the driving unit to start an irradiation of the plasma when a pattern portion included in the original and the plasma irradiating portion do not face each other.


