Plasma Mounting Table Sleeve Adhesive Protection
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in maintaining adhesive integrity due to exposure to plasma or radicals, leading to deterioration and reduced heat conduction in electrostatic chucks, affecting processing uniformity and accuracy.
Innovation Solution
A mounting table design featuring an electrostatic chuck with a first through-hole and a base with a larger second through-hole, where a tubular sleeve is bonded using a second adhesive, blocking plasma or radicals and preventing direct exposure to the first adhesive, which is used between the electrostatic chuck and the base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the mounting table structure is assembled using adhesive bonding to join structural members, then the device complexity is reduced and ease of manufacture is improved, but the adhesive is exposed to plasma or radicals causing deterioration of adhesive strength and reliability
Solution Approach 1:
The patent introduces a protective film as an intermediary layer between the adhesive and the plasma environment. This film acts as a mediator that allows the adhesive bonding structure to remain in place while protecting the adhesive from direct exposure to harmful plasma or radicals, thus maintaining both the ease of manufacture and the reliability of the adhesive joint
Solution Approach 2:
The protective film is applied in advance before the mounting table is exposed to plasma. This preliminary protective action prevents the adhesive from being damaged by plasma or radicals before the deterioration can occur, thereby maintaining adhesive strength throughout the operational life of the device
2Adaptability or versatility
If the adhesive is exposed to plasma or radicals during operation, then the mounting table can be used for plasma processing, but the adhesive components are damaged causing wear and deterioration of adhesive strength
Solution Approach 1:
The protective film serves as an intermediary barrier that allows the mounting table to function in the plasma environment while preventing direct contact between the adhesive and harmful plasma or radical species, thus maintaining adhesive integrity during plasma processing operations
Solution Approach 2:
The protective film provides beforehand cushioning or protection to the adhesive against plasma exposure. This pre-established protective layer absorbs or deflects the harmful effects of plasma and radicals before they can reach and damage the adhesive, ensuring long-term stability of the bonded structure
3Duration of action of stationary object
If the adhesive deteriorates due to plasma exposure, then continued operation is possible, but heat conduction control becomes difficult affecting manufacturing precision and processing accuracy
Solution Approach 1:
The protective film acts as a mediator that preserves the thermal conduction properties of the adhesive by preventing plasma-induced deterioration. This allows the mounting table to operate for extended durations while maintaining consistent heat conduction control, thereby preserving manufacturing precision and processing accuracy throughout the operational life
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents adhesive deterioration, ensuring stable operation and maintaining heat conduction efficiency, even under high-temperature conditions, thereby enhancing processing accuracy and extending the lifespan of the plasma processing apparatus.
Implementation Method 1
an electrostatic chuck having a diameter substantially equal to or preferably slightly smaller than a diameter of the substrate to be processed
Implementation Method 2
the adhesive for adhesively bonding the members, such as an erosion resistance insulating material made of an acrylic material
Implementation Method 3
a plasma generated by an RF power
Implementation Method 4
a through-hole penetrating through a base and an electrostatic chuck is formed to flow a heat transfer gas between a top surface of a mounting table and a backside of a substrate
Data Source
AI summary
A mounting table includes an electrostatic chuck, a base, and a cylindrical sleeve. The electrostatic chuck has a top surface to be exposed to plasma and a bottom surface opposite to the top surface, and a first through-hole is formed through the electrostatic chuck. The base is bonded to the bottom surface of the electrostatic chuck by a first adhesive, and a second through-hole is formed through the base. The second through-hole communicates with the first through-hole and has a diameter larger than a diameter of the first through-hole. The sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole.