Plasma Placing Table Wiring Through Holes
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Solution Overview
Problem
Plasma treatment apparatuses face challenges in achieving in-plane uniformity of workpiece processing due to temperature variations, which are exacerbated by the presence of through holes in the placing table that can create temperature singular points.
Innovation Solution
The placing table design includes a supporting member with heaters and wiring layers, where through holes are strategically placed in a second region surrounding the placing region, reducing temperature singular points and enhancing thermal management by alleviating stress through flexible lead wires and insulating portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are provided in the base for wiring connection, then electrical connectivity is achieved, but temperature singular points are generated causing in-plane temperature variation
Solution Approach 1:
The patent extracts the through holes from the first region (placing region) and relocates them to the second region (outer peripheral region). This separation removes the harmful thermal effect of through holes from the critical placing area while preserving their essential electrical connectivity function in the peripheral region.
Solution Approach 2:
The base is divided into two regions with different functional qualities: the first region (placing region) is designed to be free of through holes to maintain thermal uniformity, while the second region (outer peripheral region) contains the through holes for electrical connectivity. This local differentiation optimizes each region for its specific purpose.
2Ease of manufacture
If through holes are provided in the first region, then wiring access is simplified, but temperature singular points are generated in the placing region
Solution Approach 1:
The patent extracts the through holes from the first region and relocates them to the second region. This maintains wiring access capability while eliminating the harmful effect of through holes on temperature uniformity in the placing region.
Solution Approach 2:
The patent resolves the conflict by changing the spatial dimension of through hole placement from the central placing region to the peripheral region. This dimensional relocation allows wiring access to be maintained while protecting the placing region from temperature singular points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses in-plane temperature variations of the workpiece during plasma treatment, improving processing uniformity and reliability.
Implementation Method 1
The one or more heaters are provided in the main body... The heater controls the temperature of the workpiece
Implementation Method 2
The plasma treatment apparatus includes a placing table on which the workpiece is placed. The placing table includes an electrostatic chuck
Data Source
AI summary
A placing table on an embodiment includes a supporting member and a base. The supporting member includes a placing region provided with a heater, and an outer peripheral region surrounding the placing region. The base includes a first region supporting the placing region thereon, and a second region surrounding the first region. In the second region, through holes are formed. Wirings electrically connected to the heater passes through the through holes of the second region.