Plasma Enhanced Polymer Coating for Implantable Device Packaging

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Solution Overview

Problem

Current packaging technologies for implantable medical devices are not cost-effective, compatible with miniaturization, and fail to provide adequate protection against bodily fluids and temperature defects, requiring improved hermetic biocompatible solutions for both the device and patient safety.

Innovation Solution

A biocompatible multi-layer polymeric coating is applied via vapor deposition, comprising pairs of layers formed by precursor dissociation and plasma-enhanced deposition, with each pair differing in diffusion barrier properties, enhancing the overall barrier effect through increased layer interfaces rather than individual layer thickness, using materials like di-p-xylylene and its halogenated derivatives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional packaging methods are used, then device protection is provided, but cost-effectiveness and compatibility with miniaturization are poor

Engineering Contradiction:

Improvedevice protectionVSAvoidcost-effectiveness

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The packaging is divided into multiple thin layers (typically 3-5 layers) rather than using a single thick layer. Each layer has a thickness of 1-10 micrometers, creating a multi-layer barrier structure that provides enhanced protection while maintaining cost-effectiveness and compatibility with miniaturization requirements for implantable medical devices

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses composite polymeric materials consisting of multiple different polymer layers with complementary properties. The layers include barrier layers (e.g., parylene, polyimide) for fluid resistance, structural layers for mechanical strength, and adhesive layers for bonding, creating a composite structure that achieves superior protection at reduced cost and scale

Inventive Principle:

Principle #40Composite materials

2Reliability

If traditional packaging methods are used, then device protection is provided, but compatibility with miniaturization is poor

Engineering Contradiction:

Improvedevice protectionVSAvoidpackaging thickness

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of increasing protection by adding thickness in one dimension, the invention distributes protection across multiple dimensions by creating a multi-layer structure. The cumulative barrier effect of several thin layers provides superior protection equivalent to or better than much thicker single layers, enabling miniaturization of the overall device package

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If conventional coating processes are used, then coverage is achieved, but manufacturing speed and handling efficiency are reduced

Engineering Contradiction:

Improvecoating coverageVSAvoidmanufacturing speed

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The invention combines multiple coating operations into a single integrated vapor deposition process. All polymeric layers are deposited in-situ in sequence within the same vacuum chamber without breaking vacuum or handling intermediate substrates, eliminating multiple handling steps and significantly increasing manufacturing speed while maintaining complete coverage

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The vapor deposition process operates continuously to deposit all layers without interruption. The substrate remains in the vacuum chamber throughout the entire multi-layer deposition sequence, with only the deposition parameters changed between layers, eliminating idle time and handling operations that would otherwise break the continuous coating action

Inventive Principle:

Principle #20Continuity of useful action

4Reliability

If high temperature application is used, then coating deposition is achieved, but temperature defects occur in medical devices

Engineering Contradiction:

Improvecoating depositionVSAvoidapplication temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The invention replaces thermal field-based coating processes with a vacuum field-based vapor deposition process. Coatings are applied by evaporating precursor materials in vacuum and allowing them to condense on the substrate, eliminating the need for high temperature heating that would cause thermal damage to temperature-sensitive medical device components

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The deposition process operates at low substrate temperatures by changing the fundamental deposition mechanism from thermal to vacuum-based. The vacuum environment allows precursor materials to deposit as vapors without requiring thermal activation, enabling coating of heat-sensitive implantable devices at temperatures that prevent thermal defects

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a cost-effective, rapid, and reliable packaging method with low permeability to bodily fluids, protecting both the medical device and the patient, while maintaining mechanical and chemical stability at room temperature, thereby addressing the limitations of existing technologies.

Implementation Method 1

a biocompatible multi-layer polymeric coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components

Methodology Applied

Scientific EffectVapor deposition: Physical Vapour Deposition

Implementation Method 2

the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced-precursor and then deposition of the plasma-enhanced precursor

Methodology Applied

Scientific EffectPlasma dissociation and excitation: Plasma

Implementation Method 3

one layer formed by dissociation of a precursor and then simple deposition of that precursor

Methodology Applied

Scientific EffectPrecursor dissociation: Pyrolysis

Data Source

PatentUS8313811B2Plasma enhanced polymer ultra-thin multi-layer packaging

Publication Date: 2012.11.20 COAT X SA

AI summary

An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.