Plasma Polymerized Conformal Coating for Electrical Assemblies
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Solution Overview
Problem
The existing parylene deposition process for conformal coatings is costly, energy-intensive, and requires high vacuum conditions, making it inefficient for widespread use in the electronics industry.
Innovation Solution
A method involving plasma polymerization of specific compounds, such as 1,4-dimethylbenzene, and fluorohydrocarbons, to create a conformal coating with improved chemical, electrical, and physical protection, while reducing manufacturing costs and energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If parylene deposition process is used, then chemical, electrical and physical protection is improved, but manufacturing cost increases
Solution Approach 1:
The patent changes the chemical parameters of the deposition process by using alternative precursor materials (organometallic compounds, alkoxides, carboxylic acids) and modifying process conditions (temperature ranges, pressure levels, gas flow rates) to achieve comparable protection performance at lower cost. The solution involves optimizing deposition parameters such as using plasma-enhanced chemical vapor deposition (PECVD) at lower temperatures and pressures compared to traditional parylene processes.
2Reliability
If parylene deposition process is used, then protection performance is improved, but energy consumption increases
Solution Approach 1:
The patent utilizes phase transition mechanisms in plasma-enhanced chemical vapor deposition where reactants transition from gas phase to plasma state and then deposit as solid coating. This plasma phase transition enables lower temperature processing compared to thermal vapor deposition, reducing thermal energy consumption while maintaining coating quality and protection performance.
3Reliability
If parylene deposition process is used, then protection performance is improved, but process complexity increases
Solution Approach 1:
The patent replaces the mechanical vacuum system requirements with plasma chemistry control. By using plasma-enhanced processes, the deposition can occur at higher pressures compared to traditional PVD, reducing the stringency of vacuum requirements. The plasma chemistry enables coating formation under less extreme vacuum conditions, simplifying the overall system complexity while maintaining protection performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method achieves a conformal coating with enhanced protection properties, comparable to parylene, but with a more efficient and cost-effective process, utilizing plasma polymerization to deposit multiple layers with specific chemical and physical characteristics.
Implementation Method 1
plasma polymerization of a first compound of formula (I) and deposition of a resulting polymer of the first compound of formula (I) onto the at least one surface of the substrate, and plasma polymerization of a first fluorohydrocarbon and deposition of a resulting polymer of the first fluorohydrocarbon
Implementation Method 2
deposition of a resulting polymer of the first compound of formula (I) onto the at least one surface of the substrate
Data Source
AI summary
An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.