Integrated Plasma Power Module With Monolithic Cooling Layout
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Solution Overview
Problem
Existing plasma processes face challenges with inefficient power supply systems that limit power density, stability, and thermal management, particularly at high frequencies, leading to issues like thermal drift and parasitic inductances.
Innovation Solution
An integrated power module with a ceramic substrate metalized by direct bonded copper, incorporating a switch element and driver circuit, and a fluid flowable heatsink, designed for high-frequency operation with reduced parasitic inductances and enhanced thermal stability, allowing for closer packing and efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete devices are used in power supply systems, then ease of manufacture is improved, but power density and thermal management efficiency deteriorate
Solution Approach 1:
The patent integrates the driver circuit and switch element into a single packaged integrated power module, merging previously discrete components. This integration achieves higher power density by reducing the overall footprint and allowing closer packing of modules, while maintaining ease of manufacture through standardized packaging and assembly processes.
Solution Approach 2:
The patent transitions from two-dimensional PCB mounting of discrete components to a three-dimensional integrated module structure with multiple layers (ceramic substrate with metalized layers). This dimensional change enables higher power density by utilizing vertical space and reducing parasitic inductances through optimized current paths.
2Productivity
If switching frequency is increased to improve productivity, then power output is improved, but thermal drift and stability worsen
Solution Approach 1:
The patent introduces a ceramic substrate as an intermediary thermal management component between the power components and the external environment. This substrate provides both electrical insulation and thermal conduction pathways, enabling high-frequency switching while maintaining thermal stability through efficient heat dissipation to the heatsink.
Solution Approach 2:
The patent replaces traditional mechanical/thermal coupling methods with direct thermal conduction through the ceramic substrate and heatsink interface. This substitution enables more efficient thermal management at high switching frequencies by providing dedicated thermal pathways independent of electrical signals.
3Power
If component integration is increased to improve power density, then power density is improved, but parasitic inductances worsen
Solution Approach 1:
The patent applies local quality optimization by carefully designing the metalized layers and conductor tracks on the ceramic substrate. Different regions of the substrate have optimized trace widths, layer configurations, and via placements to minimize parasitic inductances in critical current paths while maintaining high power density throughout the module.
Solution Approach 2:
The patent incorporates preliminary design considerations for minimizing parasitic inductances during the module fabrication process. The ceramic substrate is metalized with optimized conductor patterns before component attachment, ensuring that low-inductance current paths are established in advance rather than added subsequently.
4Stability of the object's composition
If thermal management is enhanced through heatsink integration, then thermal stability is improved, but device complexity increases
Solution Approach 1:
The patent merges the heatsink with the ceramic substrate into an integrated thermal management system. This combination enhances thermal stability by providing direct thermal coupling between power-dissipating components and the heatsink, while reducing device complexity compared to separate heatsink attachments requiring additional mounting hardware and thermal interface materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated power module achieves higher power density, stable switching behavior, and improved thermal management, reducing thermal drift and parasitic inductances, enabling faster switching cycles and efficient energy transfer.
Implementation Method 1
a substrate made of ceramic material with both sides metalized by direct bonded copper
Implementation Method 2
a fluid flowable heatsink made from metal sheets, in particular copper sheets
Implementation Method 3
the heatsink and the third layer are connected in a monolithic way
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
Disclosed is an integrated power module (10) for a plasma process (66) comprising: a substrate (11) made of ceramic material with both sides metalized by direct bonded copper, a switch element (16) and a driver circuit (34), wherein the switch element (16) and the driver circuit (34) are arranged directly on the substrate (11), wherein the substrate (11) comprises a first layer (70) made from copper and a second layer (72) made from ceramic and a third layer (74) made from copper and/or aluminum, wherein the first layer (70) is directed towards the switch element (16) and the driver circuit (34), wherein the second layer (72) is arranged between the first layer (70) and the third layer (74), wherein a fluid flowable heatsink (76) made from metal sheets, in particular copper sheets, is arranged at the third layer (74), wherein the heatsink (76) and the third layer (74) are connected in a monolithic way.