Plasma Power Control With Predictive Impedance Matching

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Solution Overview

Problem

Existing plasma processing systems face challenges in quickly and accurately matching impedance changes, which affects efficient power transfer and plasma density control.

Innovation Solution

An adaptive control architecture with a feedforward control system between control loops is implemented, allowing for centralized and cohesive control of the plasma processing system. This includes a process power controller with a source predictor and a process uniformity controller, which anticipate and adjust impedance changes to maintain optimal power delivery.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a conventional feedback control system is used to adjust impedance matching, then the system can eventually reach the correct impedance match, but the response time is too slow and the impedance changes are not matched quickly enough

Engineering Contradiction:
Improveimpedance matching speedVSAvoidpower transfer efficiency
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent implements a feedforward control mechanism that predicts impedance changes before they occur. The predictor uses process parameters (gas flow rates, pressure, temperature) to anticipate impedance variations, allowing the impedance matching network to adjust proactively rather than reactively. This preliminary action resolves the contradiction by enabling fast response speed while maintaining reliable power transfer efficiency.

Inventive Principle:
Principle #10Preliminary action

2Stability of the object's composition

If multiple antennas are used to control plasma density at different locations, then plasma uniformity is improved, but the system impedance becomes more complex and harder to match

Engineering Contradiction:
Improveplasma density uniformityVSAvoidimpedance matching complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent introduces an impedance matching network as an intermediary component between the power supply and multiple antennas. This network includes variable reactance elements that can independently adjust impedance for each antenna channel. The intermediary simplifies the complex impedance management by providing dedicated control for each antenna, allowing plasma density uniformity to be maintained while reducing the overall system impedance complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the impedance matching network is adjusted frequently to track impedance changes, then power transfer efficiency is maintained, but the adjustment time and system instability increase

Engineering Contradiction:
Improvepower transfer efficiencyVSAvoidadjustment time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The predictor component analyzes process parameters to forecast impedance changes before they significantly impact power transfer. This allows the impedance matching network to make single, proactive adjustments rather than frequent reactive adjustments. The preliminary prediction reduces adjustment time and stabilizes the system while maintaining reliable power transfer efficiency.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system implements a hybrid feedforward-feedback control mechanism. The feedforward predictor provides proactive impedance adjustment based on process parameters, while the feedback mechanism monitors actual impedance and makes minor corrections if needed. This combination maintains power transfer efficiency while minimizing adjustment frequency and time.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS20250037973A1Control and prediction of multiple plasma coupling surfaces and corresponding power transfer
Publication Date: 2025.01.30 APPLIED MATERIALS INC
  • US20250037973A1 patent drawing
  • US20250037973A1 patent drawing
  • US20250037973A1 patent drawing

AI summary

Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.