Plasma Preclean Exhaust Paths for Gentle Cluster Tool Pressure Shifts
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Solution Overview
Problem
The challenge arises from the need to transition substrates between environments with significantly different pressures, such as vacuum and atmospheric pressures, which can cause damage during substrate transfer in cluster tools used for semiconductor manufacturing.
Innovation Solution
A plasma processing system with a process chamber that includes alternative exhaust and supply lines with different diameters to manage pressure transitions slowly and efficiently, preventing substrate damage from abrupt pressure changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate is transferred between chambers operating at different pressures (vacuum and atmospheric), then deposition process can be performed, but substrate may be damaged due to abrupt pressure changes
Solution Approach 1:
A pressure transition chamber is introduced as an intermediary between the vacuum deposition chamber and atmospheric load lock chamber. This intermediate chamber allows gradual pressure equalization through controlled gas flow, preventing abrupt pressure changes that would damage the substrate while enabling transfer between chambers at different pressures.
Solution Approach 2:
The pressure transition chamber is divided into a first portion (vacuum side) and a second portion (atmospheric side) separated by a partition. This segmentation allows independent pressure control in each region, enabling the system to maintain different pressures on either side of the partition while facilitating gradual pressure equalization when the partition is removed or opened.
2Adaptability or versatility
If plasma preclean chamber operates at vacuum pressure while deposition chamber operates at atmospheric pressure, then specialized plasma processing can be performed, but system complexity increases due to pressure differential management
Solution Approach 1:
The pressure transition chamber serves multiple functions: it acts as a vacuum chamber for plasma preclean processing, serves as a pressure equalization chamber during substrate transfer, and functions as an atmospheric interface chamber. This multi-functionality reduces the need for separate dedicated chambers for each function, thereby reducing overall system complexity while maintaining versatility.
Solution Approach 2:
The invention merges the pressure transition function with the plasma processing function by making the pressure transition chamber capable of operating as a vacuum chamber for plasma preclean. This combination eliminates the need for a separate vacuum-to-atmospheric transition chamber, reducing system complexity while maintaining both plasma processing capability and pressure transition functionality.
3Loss of time
If rapid pressure change is used during substrate transfer, then transfer time is reduced, but substrate mechanical damage risk increases
Solution Approach 1:
The system dynamically adjusts the pressure equalization rate based on substrate sensitivity and process requirements. The partition in the pressure transition chamber can be rapidly removed when appropriate, allowing controlled but relatively fast pressure equalization. This dynamic approach optimizes the balance between transfer speed and substrate protection, avoiding both overly rapid changes that cause damage and overly slow changes that waste time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively performs a vacuum-pressure plasma preclean process on substrates while ensuring smooth pressure transitions, thereby preventing mechanical damage and enabling efficient processing in cluster tools operating at varying pressures.
Implementation Method 1
a vacuum pump; a first exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump; and a second exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump
Implementation Method 2
Plasma preclean system for cluster tool... a plasma processing system for cleaning a substrate
Data Source
AI summary
A plasma processing system for cleaning a substrate is provided. The plasma processing system includes a process chamber that includes: a chamber body enclosing an interior volume; and a substrate support disposed in the interior volume. The plasma processing system includes a vacuum pump; a first exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump; and a second exhaust line fluidly coupled between the interior volume of the process chamber and the vacuum pump. The first exhaust line and the second exhaust line are arranged to provide alternative paths for the exhaust between the interior volume and the vacuum pump, and the first exhaust line has an internal diameter that is at least 50% smaller than the internal diameter of the second exhaust line.