Pressure Sensor Heating Layout for Stable Plasma Chamber Detection
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Solution Overview
Problem
The existing plasma processing apparatuses face issues with pressure gauge accuracy due to temperature differences between the gauge's location and the plasma formation area, leading to fluctuations in pressure detection and impaired processing yield.
Innovation Solution
A plasma processing apparatus with a pressure sensor connected through a buffer and heating system to match the sensor's temperature to the plasma generation space, reducing temperature differences and overheating, and using a heat-insulating plate to maintain accurate pressure detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the pressure gauge is placed at a distance from the plasma formation area, then the plasma processing can be performed, but the temperature difference causes detection errors and processing fluctuations
Solution Approach 1:
The patent applies preliminary action by heating the pressure gauge before pressure measurement to match the temperature of the plasma formation area. The temperature control unit activates the heating unit in advance to raise the gauge temperature, preventing temperature difference-induced detection errors before they occur during the measurement process.
Solution Approach 2:
The patent changes the temperature parameter of the pressure gauge by introducing a heating unit controlled by a temperature control unit. This actively adjusts the gauge's temperature to match the plasma formation area's temperature, resolving the detection accuracy issue caused by temperature differences.
2Measurement precision
If the pressure gauge is heated to match plasma area temperature, then detection accuracy improves, but the gauge may overheat and cause additional errors
Solution Approach 1:
The patent implements feedback control through a temperature control unit that continuously monitors the pressure gauge's temperature and adjusts the heating unit's output accordingly. This closed-loop feedback system ensures the gauge reaches the target temperature without overheating, maintaining detection accuracy while preventing harmful excessive temperature rises.
3Measurement precision
If calibration work is performed frequently, then pressure gauge accuracy is maintained, but processing time and productivity are reduced
Solution Approach 1:
The patent enables the pressure gauge to perform self-calibration through automated temperature control. The temperature control unit automatically adjusts the gauge temperature to match the plasma formation area temperature without requiring manual calibration operations, allowing the system to maintain accuracy while continuing normal wafer processing uninterrupted.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the accuracy of pressure detection, reduces detection errors, and enhances the reproducibility and yield of wafer processing by maintaining a stable temperature gradient for the pressure sensor.
Implementation Method 1
a heater that forms a temperature gradient in which temperatures of the connecting pipe and the buffer part rise toward the pressure sensor
Implementation Method 2
a pressure sensor that is connected to the sample table base through a connecting pipe and a buffer part
Implementation Method 3
The pressure sensor is stored in a place partitioned by a heat insulating plate at a corner of the base plate
Data Source
AI summary
A plasma processing apparatus includes a sample table base that is placed on a periphery of a sample table, a pressure sensor that is connected to the sample table base through a connecting pipe and a buffer part, a heater that forms a temperature gradient in which temperatures of the connecting pipe and the buffer part rise toward the pressure sensor, and adjusts heating to bring the pressure sensor to a temperature similar to a plasma generation space above the sample table, and a rectangular base plate that is placed under the sample table base. The pressure sensor is stored in a place partitioned by a heat insulating plate at a corner of the base plate outside the sample table base on the rectangular base plate, and an inside and an outside of the corner part are communicated with each other through an opening.