Plasma Processor Distributor for Multi-Wafer Deposition
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Solution Overview
Problem
In multi-wafer atomic layer deposition systems, generating uniform plasma across multiple reaction spaces is challenging, often requiring complex and costly equipment with separate plasma power sources for each space.
Innovation Solution
A plasma processor with a plasma distributor and splitter system that connects multiple plasma electrodes to a single power source, using sensors and driving circuits to distribute and control plasma power uniformly across reaction spaces, allowing for efficient plasma generation in each space without the need for separate power sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate plasma power sources are used for each reaction space to generate uniform plasma, then plasma uniformity is improved, but device complexity and cost increase
Solution Approach 1:
Multiple plasma power sources are merged into a single shared plasma power source. The patent connects multiple reaction spaces to one plasma power source through a plasma distribution system that includes switching elements and impedance matching units, eliminating the need for separate power sources while maintaining plasma uniformity across all reaction spaces.
Solution Approach 2:
The plasma distribution system is segmented into modular components including switching elements and impedance matching units for each reaction space. This segmentation allows independent control of plasma power distribution to each reaction space while using a single shared power source, resolving the contradiction between using multiple power sources and system complexity.
2Manufacturing precision
If separate plasma power sources are used for each reaction space to generate uniform plasma, then plasma uniformity is improved, but cost increases
Solution Approach 1:
Multiple plasma power sources are merged into a single shared plasma power source. The patent connects multiple reaction spaces to one plasma power source through a plasma distribution system that includes switching elements and impedance matching units, eliminating the need for separate power sources while maintaining plasma uniformity across all reaction spaces.
3Device complexity
If a single plasma power source is shared across multiple reaction spaces, then device complexity is reduced, but plasma uniformity becomes difficult to maintain
Solution Approach 1:
The plasma distribution system is segmented into modular components including switching elements and impedance matching units for each reaction space. This segmentation allows independent control of plasma power distribution to each reaction space while using a single shared power source, resolving the contradiction between using multiple power sources and system complexity.
Solution Approach 2:
The plasma distribution system employs dynamic switching elements that can rapidly connect and disconnect individual reaction spaces to the plasma power source. This dynamic control enables precise regulation of plasma power delivery to each reaction space, maintaining plasma uniformity despite using a single shared power source.
4Reliability
If multiple plasma power sources are used for each reaction space, then plasma generation reliability is improved, but device complexity increases
Solution Approach 1:
Multiple plasma power sources are merged into a single shared plasma power source. The patent connects multiple reaction spaces to one plasma power source through a plasma distribution system that includes switching elements and impedance matching units, eliminating the need for separate power sources while maintaining plasma uniformity across all reaction spaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simple and cost-effective generation of uniform plasma in each reaction space, improving deposition efficiency and reducing equipment complexity in multi-wafer processing systems.
Implementation Method 1
A plasma processor with a plasma distributor and splitter system that connects multiple plasma electrodes to a single power source
Implementation Method 2
The first plasma processor may further include a sensor connected between the output terminals of the distributing circuits and the plasma electrodes
Implementation Method 3
The first plasma processor may further include a plasma distributor driving circuit connected to the sensor and controlling the operation of the plasma distributor
Data Source
AI summary
A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reaction spaces, a plurality of plasma electrodes respectively disposed in the reaction spaces, a first plasma processor connected to at least two plasma electrodes, and a first plasma power source connected to the first plasma processor. The first plasma processor may include a plasma distributor or a plasma splitter.