Plasma Inspection via Reflected Wave Monitoring

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Solution Overview

Problem

Plasma processing in plasma processing apparatuses often results in substrate damage and contamination due to unstable plasma ignition, which existing methods fail to adequately address.

Innovation Solution

An inspection method that monitors the power of reflected waves, specifically radio frequency or microwave waves, to determine the fluctuation in peak-to-peak voltage or impedance at the lower electrode, allowing for the assessment of plasma sheath fluctuations and subsequent contamination risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If plasma ignition is performed in the plasma processing apparatus, then substrate processing can be carried out, but substrate damage and contamination occur due to unstable plasma ignition

Engineering Contradiction:
Improveplasma ignition stabilityVSAvoidsubstrate damage and contamination
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary monitoring of reflected wave power before substrate processing to detect plasma ignition stability. By observing the reflected wave characteristics during the plasma ignition phase, the system can identify unstable ignition conditions before they cause substrate damage, allowing preventive actions to be taken.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system continuously monitors the reflected wave power from the plasma generation process and uses this feedback information to assess plasma ignition stability. The control unit analyzes the reflected wave characteristics in real-time to determine whether plasma ignition is stable, providing continuous feedback on the plasma generation process quality.

Inventive Principle:
Principle #23Feedback

2Measurement precision

If reflected wave power is monitored to detect plasma ignition stability, then substrate contamination can be detected, but the system complexity increases

Engineering Contradiction:
Improvesubstrate contamination detection accuracyVSAvoidmonitoring system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The system uses the reflected wave as an intermediary parameter to indirectly measure plasma ignition stability and substrate contamination risk. Instead of directly measuring substrate contamination, the system monitors the reflected wave power from the plasma generation process, which serves as a mediator that correlates with plasma stability and potential contamination.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The system replaces direct physical inspection methods with electromagnetic wave-based monitoring. By using radio frequency or microwave reflections to detect plasma ignition stability, the system substitutes complex mechanical or direct sampling measurement systems with a non-contact, electromagnetic field-based detection approach.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the detection of substrate contamination by measuring fluctuations in the plasma sheath, thereby preventing damage and contamination by determining if the fluctuation meets allowable conditions, ensuring stable plasma processing.

Implementation Method 1

a source power supply configured to supply a power wave for generation of plasma from gas in the chamber to the gas in the chamber

Methodology Applied
Scientific EffectPlasma generation: Plasma

Implementation Method 2

a matching unit configured to adjust an output impedance of the source power supply to an input impedance of the chamber

Methodology Applied
Scientific EffectImpedance matching:

Data Source

PatentUS11705313B2Inspection method and plasma processing apparatus
Publication Date: 2023.07.18 TOKYO ELECTRON LTD
  • US11705313B2 patent drawing
  • US11705313B2 patent drawing
  • US11705313B2 patent drawing

AI summary

An inspection method is provided. The inspection method includes monitoring power of a reflected wave of a power wave supplied from a source power supply for generation of plasma in a plasma processing apparatus, and obtaining a fluctuation amount of a measured value within a period after initiation of the supply of the power wave. The fluctuation amount of the measured value is a fluctuation amount indicating a fluctuation in a peak-to-peak voltage at a lower electrode of the substrate support in the chamber or a fluctuation amount indicating a fluctuation in impedance of a load including the lower electrode.