Plasma-Resistant Ceramic Member with Fluoride Surface Modification
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Solution Overview
Problem
Conventional ceramic coating layers used in semiconductor manufacturing, such as those with yttrium oxide or yttria-stabilized zirconia, suffer from plasma resistance issues and contamination problems when exposed to fluorine or chlorine-containing plasma environments, leading to reduced wafer production yield and increased post-processing costs due to the difficulty in maintaining a stable composition and density during high-temperature plasma spraying or PVD processes.
Innovation Solution
A plasma-resistant ceramic member is created by surface-modifying the ceramic coating layer with a composition containing F− or Cl− anions using a low-cost vaporization and thermal treatment technique, where a substrate coated with a lower oxide layer is modified by vaporizing F or Cl-containing raw materials and adsorbing them onto the surface, forming a surface layer with improved plasma resistance and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional plasma spraying or PVD methods are used to form F-containing YOxFy coating layer, then plasma resistance is improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The invention changes the manufacturing parameters from complex multi-step plasma spraying or PVD processes to a simple thermal treatment process at 100-500°C. This parameter change maintains plasma resistance while dramatically reducing manufacturing complexity by using straightforward heating to vaporize F-containing raw materials that then deposit on the oxide coating layer surface.
Solution Approach 2:
The invention uses inexpensive F-containing raw materials (such as NF3, CF4, SF6 gases or solid compounds like CaF2, BaF2) that can be easily vaporized and deposited. These simple, low-cost materials replace expensive complex coating processes, achieving the desired fluoride layer through economical thermal treatment rather than sophisticated plasma equipment.
2Manufacturing precision
If high-temperature plasma spraying is used to form coating layer, then coating density is improved, but composition stability deteriorates due to oxidation and fluorine volatilization
Solution Approach 1:
The invention performs preliminary action by first forming a complete oxide coating layer (Y2O3, YO1.5, etc.) on the substrate, then subsequently adding fluorine through low-temperature thermal treatment. This sequential approach prevents composition instability by establishing a stable oxide base first, then modifying the surface with fluorine at temperatures that prevent oxidation and volatilization issues.
Solution Approach 2:
The invention changes the temperature parameter from high-temperature plasma spraying (>1000°C) to low-temperature thermal treatment (100-500°C). This parameter change simultaneously achieves coating density through the initial oxide formation while maintaining composition stability during the subsequent fluorine deposition, avoiding oxidation and fluorine loss that occur at high temperatures.
3Ease of manufacture
If conventional oxide coating layers are used in fluorine-containing plasma environment, then manufacturing simplicity is maintained, but plasma resistance deteriorates due to chemical deterioration and contamination
Solution Approach 1:
The invention creates a composite coating structure consisting of an oxide base layer (Y2O3, YO1.5, etc.) combined with a fluoride surface layer (YOxFy). This composite material approach maintains manufacturing simplicity by using sequential simple processes (oxide deposition followed by fluorine thermal treatment) while achieving superior plasma resistance that neither oxide nor fluoride alone could provide in fluorine-containing plasma environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The surface-modified ceramic member exhibits enhanced plasma resistance, durability, and etching process stability, reducing contamination and production costs by maintaining a stable composition and density, and allowing for consistent etching rates in fluorine-containing plasma environments.
Implementation Method 1
a raw material containing one or more anions selected from the group consisting of F− and Cl− is vaporized by heating and adsorbed to the surface of the ceramic coating layer
Implementation Method 2
a raw material containing one or more anions selected from the group consisting of F− and Cl− is vaporized by heating and adsorbed to the surface of the ceramic coating layer
Data Source
AI summary
The present invention provides a plasma-resistant ceramic member, which includes a substrate and a ceramic coating layer formed on the substrate, in which the ceramic coating layer includes a lower layer consisting of an oxide formed on the substrate, and a surface layer in which an oxide composition component constituting the surface of the ceramic coating layer is surface-modified with a composition containing one or more anions selected from the group consisting of F− and Cl−, wherein the surface layer is a layer in which a raw material containing one or more anions selected from the group consisting of F− and Cl− is vaporized by heating and adsorbed to the surface of the ceramic coating layer, and thus modified with a composition containing one or more anions selected from the group consisting of F− and Cl−, and a method of manufacturing the same. According to the present invention, the plasma-resistant property, durability, and etching process stability of the ceramic member may be improved with low costs.