Plasma-Resistant Edge Processing Cover With Adjustable Chuck Gap
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrate processing apparatuses face challenges in minimizing damage to components due to plasma reactions, maintaining uniform process performance, and extending the lifespan of protective covers during plasma processing.
Innovation Solution
A substrate processing apparatus is designed with a protective cover made of materials like Nd, Pm, Sm, Gd, Y, Sc, Er, F, and O, which is easily attachable and detachable, and a coupling mechanism that allows for rotational and vertical movement, along with an optical sensor to adjust the gap based on the radius of curvature of the protective cover's round surface, ensuring effective plasma resistance and uniform processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a protective cover is used to protect components from plasma, then component damage is reduced, but the device complexity increases
Solution Approach 1:
The protective cover is divided into a dielectric plate and a separate protective cover that can be attached and detached independently. This segmentation allows the protective cover to be replaced without replacing the entire dielectric plate assembly, reducing complexity while maintaining protection functionality.
Solution Approach 2:
A coupling portion with guide portions acts as an intermediary mechanism between the dielectric plate and protective cover. This intermediary structure enables easy attachment and detachment while maintaining a secure connection during plasma processing, balancing protection with operational simplicity.
2Ease of repair
If the protective cover is made easily replaceable, then maintenance is simplified, but the reliability of the connection may worsen
Solution Approach 1:
The coupling portion incorporates guide portions that provide a controlled movement path during attachment and detachment. This dynamic guidance mechanism ensures proper alignment and secure connection during installation, while still allowing easy removal when needed, maintaining both reliability and ease of repair.
Solution Approach 2:
The guide portions are designed with curved surfaces that guide the protective cover into proper position during attachment. This curvature ensures reliable engagement while maintaining ease of removal, balancing connection stability with maintainability.
3Device complexity
If the gap between protective cover and substrate is fixed, then the structure is simpler, but process uniformity deteriorates
Solution Approach 1:
The protective cover is designed with a round surface that can rotate to adjust the gap between the cover and substrate. This dynamic adjustment capability allows optimization of plasma processing uniformity for different substrates while maintaining a relatively simple overall structure.
Solution Approach 2:
The round surface of the protective cover provides a curved geometry that enables rotational movement for gap adjustment. This spherical element allows continuous variation of the gap distance, improving process uniformity without requiring complex mechanical adjustment mechanisms.
4Duration of action of stationary object
If the protective cover uses high-plasma-resistant materials, then lifespan is extended, but manufacturing difficulty increases
Solution Approach 1:
The protective cover is segmented into a dielectric plate and a separate protective cover component. This allows the protective cover to be manufactured from high-plasma-resistant materials independently, while the dielectric plate can use different materials optimized for its electrical functions, reducing overall manufacturing difficulty.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces component damage, enhances process uniformity, extends the protective cover's lifespan, and lowers maintenance costs by using a high-plasma-resistant protective cover with an adjustable gap mechanism, maintaining efficient plasma processing.
Implementation Method 1
an optical sensor to adjust the gap based on the radius of curvature of the protective cover's round surface
Implementation Method 2
Plasma refers to an ionized gaseous state including ions, radicals, electrons, and the like. Plasma may be generated by excessively high temperatures, strong electric fields, or radio frequency (RF) electromagnetic fields.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A substrate processing apparatus includes a housing, a chuck supporting a substrate, a dielectric plate spaced apart from the chuck with the substrate therebetween, a gas supply unit configured to supply a process gas for plasma processing an edge region of the substrate, a protective cover covering an entire lower surface of the dielectric plate, attachable to and detachable from the dielectric plate, and protecting the dielectric plate from the plasma, and a coupling portion attaching and detaching the protective cover to and from the dielectric plate.