Plasma-Resistant Organic Layer for OLED Encapsulation
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Solution Overview
Problem
Existing thin film encapsulation structures for organic light-emitting devices face challenges in maintaining the flatness of organic layers during inorganic film deposition, leading to reduced water vapor transmission rates and increased risk of plasma etching, which affects the longevity and flexibility of the devices.
Innovation Solution
A compound for an encapsulation thin film is introduced, comprising a specific chemical structure and a composition that includes photocurable and thermocurable acryl-based compounds, along with photopolymerization initiators, which is used to form a multilayer structure of organic and inorganic layers, providing plasma resistance and high water vapor transmission rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inorganic films are vapor deposited through sputtering or CVD to form thin film encapsulation layers, then the encapsulation structure is formed, but the surface of the underlying organic film is etched, resulting in reduced flatness
Solution Approach 1:
A plasma-resistant structure is introduced into the lower organic layer before the inorganic film is deposited. This preliminary modification of the organic layer's surface properties prevents plasma etching during subsequent inorganic film formation, thereby maintaining flatness while still achieving effective encapsulation
Solution Approach 2:
The organic layer is designed as a composite structure combining a main organic material with a plasma-resistant additive or coating. This composite approach provides both the functional properties of the organic layer and the plasma resistance needed to prevent etching during inorganic film deposition
2Length of moving object
If thin film encapsulation is applied to meet consumer demand for thinner devices, then device thickness is reduced, but the flatness of organic layers deteriorates due to plasma etching
Solution Approach 1:
The organic layer is pre-modified with a plasma-resistant structure before thin inorganic encapsulation layers are deposited. This preliminary protection allows the use of thinner overall device structures without sacrificing flatness, as the plasma-resistant layer prevents etching that would otherwise occur during thin-film encapsulation formation
3Productivity
If plasma is used for vapor deposition of inorganic films, then inorganic layers are formed, but water vapor transmission rate is reduced due to surface etching of organic film
Solution Approach 1:
The organic layer is modified in advance to include a plasma-resistant structure that prevents surface etching during plasma-based inorganic film deposition. This preliminary protection ensures that the organic layer maintains its integrity and flatness, thereby preserving low water vapor transmission rates while still allowing effective encapsulation layer formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents plasma etching of the organic layers, maintains high flatness, and enhances the water vapor transmission rate, thereby extending the lifespan and flexibility of organic light-emitting devices.
Implementation Method 1
component B: one or more photocurable and thermocurable acryl-based compounds; and component C: one or more compounds that generate free radicals and acids upon exposure to light or heat
Implementation Method 2
The inorganic film used in the existing thin film encapsulation structure is formed by vapor deposition through sputtering, chemical vapor deposition (CVD), or other method for generating plasma
Implementation Method 3
When an underlying organic film has a structure that is weak to plasma, the surface of the underlying organic film is etched
Data Source
AI summary
A compound for an encapsulation film and a composition thereof, a film, an organic light-emitting device, and an encapsulation method are provided. The composition comprises the compound, one or more photocurable and thermocurable propenyl compounds, and one or more compounds that produce a free radical and produce an acid under light or heat. The encapsulation film includes the composition as a film of an organic layer. The organic light-emitting device includes the film. The encapsulation method involves encapsulating the organic light-emitting device using the encapsulation film. The composition containing the compound serves as an organic layer. An encapsulation film for the organic light-emitting device is manufactured by repetitively and alternately laminating an inorganic layer and the organic layer.