Plasma Processing Sample Table Temperature Control
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Solution Overview
Problem
Conventional plasma processing apparatuses face challenges in rapidly and precisely adjusting the temperature of semiconductor wafers during processing, particularly due to the difficulty in independently controlling coolant temperature and flow rate, leading to inefficient temperature control and increased manufacturing costs.
Innovation Solution
The apparatus employs a refrigeration cycle with a compressor, condenser, and expansion valve, along with a coolant bypass and flow control valves to regulate coolant flow, allowing for independent adjustment of coolant pressure and flow rate, enabling quick and precise temperature control of the sample table.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coolant supply device with large heat capacity is used to keep coolant temperature stable, then the specimen surface temperature can be kept constant, but the device size and manufacturing cost increase
Solution Approach 1:
The coolant supply device is segmented into multiple independent coolant circulation paths, each with its own flow control valve. This allows separate control of coolant flow to different regions of the specimen table, enabling precise local temperature control without requiring a single large-capacity system
Solution Approach 2:
The system uses flow control valves to dynamically adjust coolant flow rates in real-time based on temperature sensor feedback. This dynamic control allows the system to respond quickly to temperature changes without requiring excessive coolant capacity, reducing device size while maintaining temperature stability
2Productivity
If coolant flow rate is increased to cope with increased heat received by the specimen, then temperature control effectiveness improves, but the device size and cost increase
Solution Approach 1:
The coolant circulation system is divided into multiple independent paths with individual flow control valves. This segmentation enables targeted increase of coolant flow only to specific high-heat regions rather than increasing flow system-wide, maintaining heat dissipation capability while reducing overall device size
Solution Approach 2:
The system changes the flow rate parameter of coolant dynamically using flow control valves in each circulation path. By adjusting flow rates independently in different paths, the system can match coolant delivery to actual heat load requirements, improving heat dissipation efficiency without proportionally increasing device size
3Speed
If the coolant circulation system is designed for rapid temperature adjustment, then the response time to temperature changes decreases, but the system complexity increases
Solution Approach 1:
The coolant control system is segmented into multiple independent circulation paths, each with its own flow control valve and temperature sensor. This segmentation allows parallel temperature adjustments in different regions, achieving rapid overall temperature control without requiring a single complex centralized control system
Solution Approach 2:
Temperature sensors in each coolant circulation path provide feedback to the control system, which automatically adjusts flow control valves to maintain desired temperatures. This feedback mechanism enables rapid automatic temperature adjustment without complex manual control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables rapid and precise temperature adjustments, improving processing efficiency and reducing the need for large coolant supply devices, thus lowering manufacturing costs and enhancing temperature uniformity across the wafer surface.
Implementation Method 1
a refrigeration cycle having the sample table, a compressor, a condenser and an expansion valve connected in that order
Implementation Method 2
a refrigeration cycle having the sample table, a compressor, a condenser and an expansion valve connected in that order
Implementation Method 3
a refrigeration cycle having the sample table, a compressor, a condenser and an expansion valve connected in that order
Implementation Method 4
coolant is supplied and vaporized as it flows
Implementation Method 5
paths arranged in the sample table in which a coolant is supplied and vaporized as it flows
Implementation Method 6
a regulator to adjust an amount of coolant passing through the paths in the sample table and circulating in the refrigeration cycle and an amount of coolant branching and flowing through the coolant passages
Data Source
AI summary
A plasma processing apparatus is provided which processes a sample held on a sample table arranged in a process chamber in a vacuum container by using a plasma formed in the process chamber. The plasma processing apparatus comprises: paths arranged in the sample table in which a coolant is supplied and vaporized as it flows; a refrigeration cycle having the sample table, a compressor, a condenser and an expansion valve connected in that order and having the coolant circulate therein; coolant passages to cause the coolant that has passed through the expansion valve to branch and then merge with a coolant returning from the paths in the sample table toward the compressor; and a regulator to adjust an amount of coolant passing through the paths in the sample table and circulating in the refrigeration cycle and an amount of coolant branching and flowing through the coolant passages.