Plasma Tool Sensor Fusion for Autonomous Endpoint Fault Correction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plasma processing systems face challenges in accurately monitoring and controlling plasma processes due to reliance on single sensors, which can lead to inaccurate fault detection and endpoint determination, resulting in economic losses and production delays.
Innovation Solution
The implementation of a data fusion process that integrates data from multiple in-situ sensors to estimate the endpoint time and wafer state, enabling robust monitoring and fault detection even when individual sensors fail, and allowing for autonomous correction of faults.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple in-situ sensors are used for monitoring plasma process, then the accuracy and reliability of fault detection is improved, but the device complexity increases
Solution Approach 1:
The patent combines data from multiple in-situ sensors (optical emission spectrometer, mass spectrometer, reflectometer, etc.) into a unified monitoring system that performs fault detection and endpoint determination. The sensor data fusion approach merges information from different sensing modalities to improve reliability while managing complexity through integrated data processing.
Solution Approach 2:
The monitoring system is designed to perform multiple functions simultaneously: real-time fault detection, endpoint determination, process parameter estimation, and quality control. This multi-functional approach allows a single integrated system to handle various monitoring tasks that would otherwise require separate dedicated systems.
2Productivity
If real-time sensor data processing is implemented for endpoint detection, then the productivity is improved, but the measurement precision may deteriorate due to noise and sensor failures
Solution Approach 1:
The system continuously monitors sensor data and provides real-time feedback on process status, enabling dynamic endpoint detection. The feedback mechanism compares actual process parameters against target values and adjusts processing accordingly, maintaining precision while enabling rapid decision-making for high throughput.
Solution Approach 2:
The patent implements redundancy in the sensor system and data processing to cushion against potential sensor failures or noisy readings. By having multiple sensors and cross-validation mechanisms in place beforehand, the system maintains measurement precision even when individual sensors malfunction or produce noisy data.
3Loss of time
If autonomous fault correction is implemented, then the loss of time is reduced, but the device complexity increases
Solution Approach 1:
The plasma processing system incorporates autonomous fault detection and correction capabilities that enable self-service operation. When faults are detected through sensor monitoring, the system automatically initiates correction procedures without requiring manual intervention, thereby reducing production downtime while managing complexity through automated control algorithms.
Data Source
AI summary
A method of operating a plasma tool includes executing a plasma process on a wafer. Data associated with the plasma process are measured using a plurality of sensors while the plasma process is executed on the wafer. The plasma process is terminated at an endpoint time. A post-process fault detection is executed by determining whether a post-process wafer state is within a target range. When the post-process wafer state is outside the target range so that a fault is detected, the fault is corrected using the data associated with the plasma process.