Plasma Sensor Module Structure for Stronger Wafer-Based Sensing
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Solution Overview
Problem
Existing SOW type plasma sensor modules in semiconductor fabrication are structurally weak, leading to potential breakage and contamination due to cavities that weaken the wafers, which can generate particles and affect yield.
Innovation Solution
A plasma sensor module design featuring an upper substrate with a protection layer and a thicker lower substrate, directly bonded without adhesive, incorporating probes, a PCB, and a battery within the lower substrate, with cavities only on the lower substrate to enhance structural strength and enable two-dimensional plasma density detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two wafers are attached to form SOW type plasma sensor module, then plasma density sensing capability is achieved, but structural strength is weakened due to cavities and potential breakage occurs
Solution Approach 1:
The sensor module is divided into two separate substrates: an upper substrate that maintains structural integrity and a lower substrate that contains all cavities, probes, PCB, and battery. This segmentation allows the upper substrate to remain strong while the lower substrate accommodates all functional components that require cavities.
Solution Approach 2:
All functional components (probes, PCB, battery) are relocated from the upper substrate to the lower substrate, effectively moving functionality to another dimension (lower layer). This allows the upper substrate to maintain its structural strength while the lower substrate provides all necessary functional support through its thicker design that accommodates cavities.
2Device complexity
If cavities are formed in wafers to accommodate probes, PCB and battery, then functional components can be integrated, but structural strength is weakened leading to particle generation
Solution Approach 1:
The module is segmented into two substrates with clear functional division: upper substrate for structural integrity and plasma exposure, lower substrate for component integration. All cavities are formed only in the lower substrate, which is designed to be thicker and stronger to accommodate these cavities without compromising overall module strength.
Solution Approach 2:
Different regions of the module have different structural properties: the upper substrate is designed with high structural strength and no cavities to prevent particle generation, while the lower substrate is designed with cavities to accommodate components. This local differentiation allows each region to optimize for its specific function.
3Ease of manufacture
If adhesive is used to bond substrates, then assembly is simplified, but thermal coefficient differences cause additional problems
Solution Approach 1:
Instead of using adhesive as an intermediary bonding material, the patent employs direct bonding between the upper and lower substrates. This eliminates the adhesive layer that would cause thermal coefficient mismatch, allowing both substrates to be directly bonded while maintaining thermal compatibility and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides improved structural strength and reduces damage, allowing for accurate plasma density monitoring without adhesive-induced thermal coefficient differences, enhancing semiconductor fabrication yield.
Implementation Method 1
The upper substrate may be configured to be exposed to plasma... The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma
Data Source
AI summary
A plasma sensor module may include an upper substrate, a lower substrate, at least one probe and a printed circuit board (PCB). The upper substrate may be configured to be exposed to plasma. The lower substrate may contact a lower surface of the upper substrate. The lower substrate may have a thickness that is thicker than a thickness of the upper substrate. The probe may be in the lower substrate. The PCB may be in the lower substrate. The PCB may be configured to apply an alternating current to the probe to detect a density of the plasma. Thus, the structural strength of the plasma sensor module may have improved structural strength.