Multi-Chamber Plasma System Shared Impedance Matching
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Solution Overview
Problem
Current multi-chamber systems for semiconductor and liquid crystal display manufacturing are inefficient due to individual power supply structures in each process chamber, leading to increased facility area and cost, and require improved plasma density control for enhanced productivity.
Innovation Solution
A multi-chamber plasma process system with inductively coupled plasma generators, integrated power supply systems including RF power, ignition power, and impedance matching, along with variable inductors and transformers for efficient power distribution and plasma density regulation, allowing for individual control of plasma density in each chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual power supply structures are used in each process chamber, then each chamber can operate independently, but the facility area and cost increase
Solution Approach 1:
The patent combines multiple power supply systems (RF power supply, ignition power supply, impedance matchers) into a shared infrastructure. The RF power supply unit generates power that is distributed to multiple inductively coupled plasma generators through a common impedance matching system, reducing the overall facility area while maintaining independent chamber operation through individual control of each plasma generator
Solution Approach 2:
The impedance matching system is designed to serve multiple process chambers simultaneously. The impedance matcher can adjust and match impedance for different chambers, allowing a single piece of equipment to perform the function that would otherwise require separate dedicated units for each chamber
2Ease of operation
If individual power supply structures are used in each process chamber, then each chamber can be controlled independently, but the system cost increases
Solution Approach 1:
The patent merges the power supply and impedance matching functions into shared systems. The RF power supply unit and impedance matcher are common resources that serve multiple chambers, reducing the total number of components and associated costs while maintaining independent control through individual plasma generator units
3Use of energy by moving object
If inductively coupled plasma technique is used, then plasma generation is efficient, but impedance matching complexity increases
Solution Approach 1:
The impedance matcher is designed as a universal device that can handle multiple plasma generators and different impedance conditions. It provides a unified interface between the RF power supply and various plasma generators, simplifying the overall system architecture despite the complexity of individual impedance matching requirements
4Manufacturing precision
If plasma density is adjusted for each process chamber, then process precision is improved, but control complexity increases
Solution Approach 1:
The system allows each process chamber to have independent plasma density control through individual inductively coupled plasma generators. Each chamber can be optimized for its specific process requirements while using the same overall power supply and impedance matching infrastructure, achieving local optimization without proportional increase in overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces facility area and cost while improving process yield and productivity by enabling precise control of plasma density in each chamber, facilitating more complex and precise processing.
Implementation Method 1
a main power supply for supplying radio frequency (RF) power for the generation of plasma to each inductively coupled plasma generator
Implementation Method 2
as the relative position between the first and second magnetic cores is varied, magnetic flux induced by the first and second winding coils has an aligned or deflected direction or an inverse direction, and as a result inductance caused by the first and second winding coils may be varied
Implementation Method 3
an ignition power supply supplied with RF power from the main power supply, and supplying ignition power to an ignition electrode provided in the inductively coupled plasma generator
Data Source
AI summary
A multi-chamber plasma process system includes a plurality of process chambers, each of which has an inductively coupled plasma generator. The inductively coupled plasma generator is electrically connected to a main power supply through a first impedance matcher. The first impedance matcher has at least one variable inductor. Ignition electrodes of the inductively coupled plasma generators are connected in parallel with an ignition power supply configured as a variable transformer. The variable inductor of the first impedance matcher and the variable transformer of the ignition power supply are controlled by a controller. Each process chamber has a plasma density regulator. Power supply systems, including an ignition power source, a radio frequency (RF) power source, an impedance matcher, etc. can be effectively integrated. As a result, it is possible to decrease the area of facilities and the cost of the system, and to individually control the plasma density of each process chamber. Accordingly, process yield is improved, and productivity of the system is further improved.