Movable Plasma Shield Grounding for Particle-Free Substrate Cleaning
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Solution Overview
Problem
In semiconductor device manufacturing, the formation of a natural oxide film on substrates can deteriorate film characteristics during film-forming processes, and existing methods for cleaning substrates using reverse sputtering may generate particles due to ungrounded shield members being charged negatively during plasma treatment.
Innovation Solution
A substrate processing apparatus with a shield member that includes a flexible conductive connection plate to maintain electrical grounding regardless of its position, preventing particle generation by ensuring negative charges are released to the grounding line, and using a radio-frequency power source to apply ions for reverse sputtering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a shield member is driven during plasma treatment, then the substrate surface cleaning effect is improved, but particles are generated due to negative charging of the ungrounded shield member
Solution Approach 1:
The shield member is grounded in advance through the flexible conductive connection plate before plasma treatment begins, preventing negative charging and particle generation during the subsequent driven motion and cleaning process
Solution Approach 2:
The flexible conductive connection plate serves as an intermediary component that maintains electrical grounding connection with the driven shield member throughout its motion range, allowing the shield to be both movable for cleaning effectiveness and grounded to prevent particle generation
2Manufacturing precision
If the shield member is made movable to improve cleaning effectiveness, then the substrate processing quality is improved, but the electrical grounding becomes unstable
Solution Approach 1:
The flexible conductive connection plate uses a thin, flexible conductive structure that can bend and deform to accommodate the driven shield member's motion while continuously maintaining electrical grounding connection, thus preserving both movability and grounding stability
Solution Approach 2:
The grounding connection system is designed to be dynamic rather than rigid, allowing the flexible conductive connection plate to adapt its configuration as the shield member moves, ensuring continuous electrical contact throughout the full range of motion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cleans substrate surfaces by removing natural oxide films while preventing particle generation from shield member reverse-sputtering, thereby improving film-forming process outcomes.
Implementation Method 1
a radio-frequency power source configured to apply radio-frequency power to the stage to cause the ions in the plasma to act on the substrate
Implementation Method 2
a process container in which the substrate to be processed is accommodated, the process container configured to generate the plasma in an interior of the process container
Implementation Method 3
clean a substrate surface by reverse sputtering
Implementation Method 4
at least one flexible conductive connection plate configured to connect the driven portion of the shield member and a grounded portion and configured to be deformed in response to the driving of the driven portion
Data Source
AI summary
A substrate processing apparatus for processing a substrate by causing ions in plasma to act on the substrate, includes: a process container in which the substrate to be processed is accommodated, the process container configured to generate the plasma in an interior of the process container; a stage provided inside the process container and configured to place the substrate on the stage; a radio-frequency power source configured to apply radio-frequency power to the stage to cause the ions in the plasma to act on the substrate; a shield member provided inside the process container and having a driven portion; a drive mechanism configured to drive the driven portion of the shield member; and at least one flexible conductive connection plate configured to connect the driven portion of the shield member and a grounded portion and configured to be deformed in response to the driving of the driven portion.