Plasma Electrode Shield Adjustment for Edge Ring Wear Compensation
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Solution Overview
Problem
Repeating plasma processing on a substrate causes wear of the edge ring, leading to variations in the incident angle of ions on the substrate, which results in out-of-spec formation of holes and trenches, necessitating frequent replacement of the edge ring, thereby reducing productivity.
Innovation Solution
A plasma processing apparatus with a mechanism to adjust the position of a metal member along the outer wall of the lower electrode, controlled by a device to increase the overlapping area with the lower electrode as the edge ring wears, thereby maintaining optimal ion incident angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma processing is repeatedly performed on a substrate, then substrate processing is achieved, but the edge ring wears out causing variation in ion incident angles
Solution Approach 1:
The invention makes the previously static edge ring adjustable by providing a driving mechanism that can change its position along the lower electrode outer wall. This dynamic adjustment capability allows the system to adapt to wear by repositioning the edge ring, thereby maintaining ion incident angle uniformity throughout extended processing cycles without requiring frequent replacement.
Solution Approach 2:
The invention changes the positional parameter of the edge ring along the lower electrode outer wall. By adjusting the edge ring's position parameter in response to wear, the system compensates for degradation and maintains optimal ion incident angles, resolving the contradiction between extended processing time and precision maintenance.
2Manufacturing precision
If the edge ring is frequently replaced to maintain ion incident angle uniformity, then manufacturing precision is maintained, but productivity decreases
Solution Approach 1:
The system performs self-adjustment through the driving mechanism that repositions the edge ring based on wear conditions. This self-service capability eliminates the need for frequent manual replacements by operators, allowing the system to maintain precision automatically while continuing substrate processing, thus resolving the productivity-precision contradiction.
Solution Approach 2:
By transforming the edge ring from a static component to a dynamically adjustable one, the system can extend its service life through repositioning. This dynamic feature allows continuous operation without frequent stops for replacement, maintaining both high productivity and manufacturing precision simultaneously.
3Device complexity
If the edge ring position is fixed, then device complexity is low, but the system cannot compensate for wear over time
Solution Approach 1:
The invention introduces a driving mechanism that enables the edge ring to move along the lower electrode outer wall. This dynamic positioning capability, while increasing device complexity, provides the reliability needed to compensate for wear and maintain consistent performance over extended periods, resolving the contradiction between simplicity and reliability.
Solution Approach 2:
The system gains the ability to change the edge ring's positional parameter in response to wear conditions. This parameter adjustment capability enhances reliability by maintaining performance consistency, justifying the increased complexity through improved long-term operational reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses the variation in ion incident angles, preventing out-of-spec formation of substrate features and extending the replacement cycle of the edge ring, thus improving process throughput.
Implementation Method 1
an electrostatic chuck provided on the lower electrode on which a substrate is placed
Implementation Method 2
Plasma is generated inside the chamber
Data Source
AI summary
A plasma processing apparatus includes a chamber, a lower electrode, an electrostatic chuck, an edge ring, a metal member, a driving unit, and a control device. The electrostatic chuck is provided on the lower electrode on which a substrate is placed. The edge ring is provided around the electrostatic chuck. The metal member is disposed along an outer wall of the lower electrode and is grounded. The driving unit moves the metal member along the outer wall of the lower electrode. The control device controls the driving unit to move the metal member so as to increase the area in which the outer wall of the lower electrode and the metal member overlap each other when viewed in a direction intersecting the surface of the outer wall of the lower electrode in accordance with an increase in the amount of wear of the edge ring.