Plasma Processing Apparatus Shielding Plates
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Solution Overview
Problem
Current plasma processing techniques face challenges in selectively utilizing ions and radicals in remote plasma, as ions can damage substrates, and existing methods lack precise control over particle selection in plasma processing.
Innovation Solution
A plasma processing apparatus with a shielding part comprising two parallel shielding plates and a controller to independently apply control voltages, allowing selective passage of ions, radicals, or electrons through the plasma, enabling precise control over the particles reaching the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If ions are used in plasma processing, then processing effectiveness is improved, but substrate damage occurs
Solution Approach 1:
The shielding part is divided into multiple shielding plates (first shielding plate, second shielding plate, third shielding plate) with through-holes arranged in specific patterns. This segmentation allows different regions to selectively transmit ions and radicals independently, enabling effective substrate processing while blocking harmful ions through coordinated voltage control of each plate segment
Solution Approach 2:
The shielding part acts as an intermediary component between the plasma source and substrate. By applying control voltages to the shielding plates, it mediates the particle flux, allowing selective transmission of beneficial radicals while blocking harmful ions, thus resolving the contradiction between processing effectiveness and substrate damage
2Device complexity
If a single shielding plate is used, then device complexity is reduced, but particle selection precision is insufficient
Solution Approach 1:
The shielding structure is segmented into multiple independently controllable shielding plates with through-holes. Each plate can be controlled by separate voltage applying parts, enabling precise spatial and temporal control over particle transmission. This segmentation achieves high particle selection precision while maintaining reasonable device complexity through modular design
Solution Approach 2:
The shielding plates are equipped with voltage applying parts that can dynamically adjust control voltages in response to processing requirements. This dynamic control capability allows the system to adaptively select and control particle flux, achieving precise particle selection that responds to real-time processing needs without requiring overly complex static structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables selective processing by allowing independent control over the types of particles (ions, radicals, or electrons) reaching the substrate, enhancing the precision and effectiveness of plasma processing without substrate damage.
Implementation Method 1
a radio frequency (RF) power supply configured to output an RF voltage to generate plasma of the gas
Implementation Method 2
a voltage applying part configured to select ions or radicals passing through the through-holes in the plasma by applying a control voltage to the shielding part
Data Source
AI summary
A plasma processing apparatus comprising: a chamber; an upper electrode; a shower head having openings, an inner space of the chamber being divided into a first space and a second space; a shielding part including first and second shielding plates arranged in parallel between the upper electrode and the shower head, the shielding part having through-holes aligned with the openings; a gas supply device configured to supply a gas; a radio frequency (RF) power supply configured to output an RF voltage; a voltage applying part configured to select ions or radicals passing through the through-holes in the plasma by applying a control voltage to the shielding part; and a controller configured to control the voltage applying part by independently applying a control voltage to each of the first and second shield plates depending on control from the controller.