Plasma Shower Head Pad Structure for Fastening Defect Control
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Solution Overview
Problem
The miniaturization of semiconductor element patterns leads to increased challenges in uniformly forming and managing patterns on larger semiconductor wafers and photomasks, and the adiabatic expansion or contraction of baffles in process chambers can cause defects at the fastening portions between the baffle and lid.
Innovation Solution
A substrate processing apparatus with a shower head having first fastening holes, an adapter separated from the shower head, and pads made of polytetrafluoroethylene (PTFE) that come into contact with the adapter and the shower head, preventing direct contact between the adapter and the shower head and reducing the likelihood of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the baffle is directly fastened to the lid, then the structure is simple, but defects occur due to adiabatic expansion and contraction
Solution Approach 1:
The patent introduces a baffle as an intermediary component between the lid and the processing chamber. This baffle acts as a mediator that absorbs adiabatic expansion and contraction forces, preventing direct stress transmission to the fastening portions and eliminating defects while maintaining structural simplicity.
2Productivity
If the substrate size is increased, then productivity is improved, but uniformity of element patterns becomes more difficult to maintain
Solution Approach 1:
The patent segments the processing chamber into multiple regions using the baffle structure, creating distinct zones that allow for independent optimization of plasma distribution and temperature control in different areas of the large substrate, thereby maintaining pattern uniformity across the entire substrate surface.
Solution Approach 2:
The patent applies local quality by positioning the baffle to create region-specific plasma flow characteristics and temperature profiles, allowing different areas of the large substrate to receive optimized processing conditions tailored to their specific requirements, ensuring uniform element pattern formation across the entire substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and yield of semiconductor device manufacturing by minimizing defects during plasma treatment processes and maintaining the integrity of the substrate processing apparatus.
Implementation Method 1
a plurality of pads between the shower head and the lid. Each of the plurality of pads may include polytetrafluoroethylene. At least a part of the plurality of pads may come into contact with a bottom surface of the adapter.
Implementation Method 2
a power supply source on the housing and configured to generate plasma, a shower head in the housing and configured to supply the plasma to the processing region
Implementation Method 3
The baffle may adiabatically expand or adiabatically contract in a semiconductor process performed inside the process chamber
Data Source
AI summary
A method may include loading a substrate into a substrate processing apparatus and performing a plasma treatment process on the substrate. The substrate processing apparatus includes a housing that defines a processing region, a power supply source on the housing and configured to generate plasma, a shower head in the housing and configured to supply the plasma to the processing region, an adapter between the power supply source and the shower head and separated from the shower head, a lid surrounding at least part of the adapter, and pads between the shower head and the lid. The shower head may include first fastening holes. The lid may be connected to the shower head through fastening portions respectively inserted into the first fastening holes. The pads may include polytetrafluoroethylene. At least a part of the pads may contact a bottom surface of the adapter.