Plasma Shower Head Shielding for Uniform Semiconductor Deposition
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges with electromagnetic interference between shower heads during plasma-based thin-film deposition, leading to non-uniform film deposition and potential damage to equipment.
Innovation Solution
The implementation of shielding members, including shower-head and strap shielding members, to enclose shower heads and power straps, respectively, prevents electromagnetic interference, ensuring uniform deposition and equipment protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple shower heads are used for plasma-based thin-film deposition, then deposition productivity is improved, but electromagnetic interference between shower heads causes non-uniform film deposition
Solution Approach 1:
A ground shield is introduced as an intermediary component between adjacent shower heads to block electromagnetic interference. The shield acts as a mediator that prevents RF energy from one shower head from interfering with adjacent shower heads, thereby maintaining uniform film deposition while allowing multiple shower heads to operate simultaneously for increased productivity
2Speed
If multiple shower heads are operated at high RF power, then deposition speed is improved, but electromagnetic interference causes equipment damage
Solution Approach 1:
The ground shield serves as a protective intermediary that isolates each shower head's RF electromagnetic field. This allows the system to operate multiple shower heads at high RF power levels for fast deposition without the electromagnetic interference that would otherwise cause equipment damage, thereby maintaining both high speed and reliability
3Manufacturing precision
If shielding members are added to enclose shower heads, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The ground shield is implemented as a thin, flexible shielding structure that can be easily integrated into the existing chamber design. This thin-film approach provides effective electromagnetic shielding while adding minimal structural complexity to the system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances deposition uniformity and reduces electromagnetic interference, improving film density and equipment longevity by isolating RF power components.
Implementation Method 1
providing radio-frequency powers to the shower heads, without an electromagnetic interference between the shower heads using shielding members, which are provided in the chamber and enclosing the shower heads
Implementation Method 2
the plasma may be produced using a high frequency power
Implementation Method 3
providing radio-frequency powers to the shower heads
Implementation Method 4
supplying a reaction gas on the substrates
Implementation Method 5
the plasma may be produced using a high frequency power
Data Source
AI summary
An apparatus for manufacturing a semiconductor device includes a chamber including a lower housing and an upper housing, heater chucks in the lower housing, shower heads on the heater chucks, the shower heads being between the lower housing and the upper housing, power supplies connected to the shower heads to provide radio-frequency powers to the shower heads, power straps in the upper housing to connect the shower heads to the power supplies, and shielding members in the upper housing, the shielding members enclosing the power straps and the shower heads, respectively, the shielding members to prevent electromagnetic interference of the radio-frequency powers between the power straps and between the shower heads.