Remote Plasma Showerhead Hole Pattern for Uniform Film Deposition
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Solution Overview
Problem
Showerheads in substrate processing systems face challenges in achieving uniform deposition due to temperature variations and non-uniform precursor gas delivery, leading to deposition non-uniformities and defects.
Innovation Solution
A showerhead design with a predetermined pattern and sizing of through holes and precursor injectors, along with a thermal control system using heat transfer fluid, to maintain uniform temperature and gas flow distribution, reducing deposition variations by up to 50%.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional showerhead with uniform through holes is used, then the structure is simple and easy to manufacture, but deposition non-uniformities occur due to temperature variations and non-uniform gas flow distribution
Solution Approach 1:
The showerhead employs through holes with different diameters (first size and second size) distributed in specific patterns to create local variations in gas flow characteristics. This local quality differentiation enables different regions of the showerhead to deliver optimized gas flow rates, compensating for temperature variations and achieving uniform deposition across the substrate surface.
Solution Approach 2:
The showerhead structure is segmented into multiple functional zones with different through hole sizes and distributions. The plurality of through holes are divided into different size categories and strategically positioned to address specific deposition non-uniformities in different regions, allowing independent optimization of gas flow in each zone.
2Temperature
If the showerhead structure is simplified, then manufacturing is easier, but temperature control uniformity deteriorates leading to deposition variations
Solution Approach 1:
The invention changes the geometric parameters of the through holes, specifically varying the diameter size across different regions. This parameter variation allows the showerhead to maintain uniform temperature distribution by optimizing gas flow rates through different sized holes, without requiring complex active temperature control mechanisms.
3Manufacturing precision
If uniform through holes are used throughout the showerhead, then the structure is straightforward, but gas flow distribution becomes non-uniform causing deposition defects
Solution Approach 1:
Different regions of the showerhead have through holes with different diameters optimized for local gas flow requirements. This local quality differentiation ensures uniform precursor gas delivery across the substrate by compensating for variations in gas consumption patterns in different regions.
Solution Approach 2:
The static geometric variation in through hole sizes creates dynamic gas flow distribution that adapts to the spatially varying demands of the deposition process, enabling uniform precursor delivery without active flow control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides uniform temperature control and gas flow delivery, enhancing deposition uniformity and reducing defects in substrate processing systems.
Implementation Method 1
a thermal control system using heat transfer fluid, to maintain uniform temperature
Implementation Method 2
A plasma gas mixture is supplied to the upper chamber and plasma is struck in the upper chamber. Some of the radicals generated by the plasma flow through the showerhead to the lower chamber.
Implementation Method 3
A precursor gas mixture is supplied to the lower chamber through the showerhead and reacts with the radicals to deposit film on the substrate.
Implementation Method 4
reacts with the radicals to deposit film on the substrate
Data Source
AI summary
A showerhead for a substrate processing system includes a lower surface, a plasma-facing upper surface, a gas plenum defined between the lower surface and the upper surface, and a plurality of injectors distributed on the lower surface, wherein the plurality of injectors are in fluid communication with the gas plenum. A plurality of through holes extends from the upper surface to the lower surface. Selected ones of the plurality of through holes have a diameter that is different from a diameter of remaining ones of the plurality of through holes. The diameter of the selected ones of the plurality of through holes is predetermined in accordance with a desired ratio of respective gases provided via the selected ones of the plurality of through holes and the remaining ones of the plurality of through holes.