Plasma Shutter Alignment Structure for Leak-Free Process Chamber Sealing
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Solution Overview
Problem
Existing substrate processing technologies face challenges in achieving exact alignment of plasma shutters, reducing particle contamination, improving plasma dispersion, and increasing substrate process yield during semiconductor fabrication processes.
Innovation Solution
A plasma shutter design with a shield door and connection block, featuring a convexly curved plasma shield surface and a gasket groove, is integrated into a substrate processing apparatus. The plasma shutter is aligned to close the process space by inserting its upper end between an extension liner and a connection inner surface, ensuring precise alignment and preventing plasma leakage, while a nickel alloy gasket enhances durability and reduces particle contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plasma shutter is used to close the process chamber, then plasma leakage is prevented, but alignment precision between the plasma shutter and process space is difficult to achieve exactly
Solution Approach 1:
An alignment mark is introduced as an intermediary element between the plasma shutter and the process space. The alignment mark consists of a first mark on the plasma shutter and a second mark on the process space, which are positioned to coincide when properly aligned. This intermediary marking system provides a visual reference that enables precise alignment without requiring complex mechanical positioning systems.
Solution Approach 2:
The alignment marks are pre-positioned on the plasma shutter and process space before the actual plasma processing begins. By establishing the alignment reference in advance, the system ensures that when the plasma shutter closes the process space, the alignment marks coincide, guaranteeing precise alignment without requiring real-time adjustment during operation.
2Device complexity
If the plasma shutter structure is simplified, then device complexity is reduced, but particle contamination increases
Solution Approach 1:
The plasma shutter is segmented into multiple functional components: a shutter body for closing the process space, an alignment mark for positioning, and a gasket for sealing. This segmentation allows each component to perform its specific function effectively. The gasket, in particular, is designed as a separate sealing element that prevents particle contamination without requiring complex integrated structures.
Solution Approach 2:
A gasket is introduced as an intermediary sealing element between the plasma shutter and the process space. This gasket provides the necessary seal to prevent particle contamination while keeping the overall shutter structure simple. The gasket acts as a mediator that achieves the sealing function without requiring complex mechanical interlocking or multiple moving parts.
3Reliability
If the plasma shutter is designed with a convexly curved plasma shield surface, then plasma dispersion is improved, but manufacturing complexity increases
Solution Approach 1:
The plasma shield surface of the plasma shutter is designed with a convex curvature rather than a flat surface. This curved geometry helps to disperse plasma more effectively by redirecting plasma flow away from the shutter surface. The curvature radius is specifically chosen to optimize plasma dispersion while remaining manufacturable using standard forming techniques.
Solution Approach 2:
The curvature radius of the plasma shield surface is optimized as a key parameter to achieve the desired plasma dispersion. By adjusting this geometric parameter, the system achieves improved plasma control without requiring complex multi-component structures. The specific curvature radius is selected to balance plasma dispersion performance with manufacturing ease.
Data Source
AI summary
Provided is a substrate processing apparatus, including a process chamber, a plasma shutter configured ascend to close the process chamber, and an upper liner on the process chamber, wherein the process chamber includes a process space in which a substrate process is performed, and an insertion passage adjacent to the process space and connecting the process space to an outside of the process chamber, wherein the upper liner includes an extension liner, wherein the extension liner faces a connection inner surface that upwardly extends from an inner end of a passage ceiling forming the insertion passage, and wherein, in a state where the plasma shutter ascends to close the process space, an upper end of the plasma shutter is inserted between the connection inner surface and the extension liner.