Temperature-Controlled Shutter for Uniform Plasma Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in maintaining temperature uniformity and reducing particle deposition on substrates during plasma processing, leading to inefficiencies and inconsistencies in processing outcomes.
Innovation Solution
A substrate processing apparatus with a shutter device featuring a temperature-controlled fluid flow path to regulate the temperature of the valve body, which helps in radiating heat and reducing temperature differences within the processing chamber, thereby minimizing particle deposition on substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional shutter without temperature control is used, then the device complexity is reduced, but temperature uniformity deteriorates and particle deposition increases
Solution Approach 1:
A temperature-controlled fluid is introduced as an intermediary substance to transfer heat away from the shutter. The fluid circulates through flow paths in the shutter, absorbing excess heat and carrying it to external heat exchangers, thereby achieving temperature control without directly cooling the shutter structure itself
Solution Approach 2:
The invention employs a hydraulic cooling system where a temperature-controlled fluid circulates through channels embedded in the shutter. This fluid-based thermal management system efficiently removes heat from the shutter while maintaining structural integrity and enabling precise temperature control
2Object-generated harmful factors
If the shutter temperature is not controlled, then the device complexity is reduced, but particle deposition on substrates increases
Solution Approach 1:
The temperature-controlled fluid acts as a mediator that prevents particle formation by controlling shutter temperature. By maintaining the shutter at an appropriate temperature, the system prevents thermal effects that would otherwise cause particle deposition on substrates during plasma processing
Solution Approach 2:
The invention converts the potentially harmful effect of heat generation in the shutter into a beneficial control mechanism. By intentionally designing heat dissipation paths and using temperature-controlled fluid circulation, the system transforms thermal management from a passive consequence into an active means of preventing particle deposition
3Stability of the object's composition
If a shutter with temperature control is implemented, then temperature uniformity is improved, but the device complexity increases
Solution Approach 1:
The shutter is divided into multiple sections with independent temperature control capabilities. Each section has its own flow paths for the temperature-controlled fluid, allowing localized temperature management and ensuring uniform temperature distribution across the entire shutter surface
Solution Approach 2:
The temperature-controlled fluid circulation system serves multiple functions simultaneously: it cools the shutter, maintains temperature uniformity, prevents particle deposition, and provides thermal stability during plasma processing. This multi-functional approach justifies the added complexity by delivering comprehensive process control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature uniformity and reduces particle deposition on substrates, improving the efficiency and consistency of plasma processing by effectively managing heat distribution and trapping particles within the chamber.
Implementation Method 1
a shutter device featuring a temperature-controlled fluid flow path to regulate the temperature of the valve body, which helps in radiating heat and reducing temperature differences within the processing chamber
Data Source
AI summary
A substrate processing apparatus includes a chamber having a plasma processing space, a sidewall of the chamber having an opening for transferring a substrate into the plasma processing space; and a shutter disposed at an inner side than the sidewall and configured to open or close the opening, the shutter having a flow path for a temperature-controlled fluid.